Microstructure, corrosion and mechanical properties of Sn–3.0Ag–0.5Cu solder alloy aged at 150 °C

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2025-05-10 DOI:10.1007/s10854-025-14858-0

Wenjing Chen, Bin Chen, Xiaowu Hu

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Abstract

With the advancement of electronic technology, electronic products have increasingly been deployed in a variety of demanding environments, such as high temperatures and corrosive liquids. This study investigated the microstructure, corrosion resistance and tensile properties of Sn–3.0Ag–0.5Cu (SAC305) solder alloy aged at 150 °C for maximum time of 240 h. The results indicated that aging treatment significantly affected the microstructure of the alloy. As the aging time increased, the coarsening of the microstructure became more pronounced, and the quantity of fine Ag₃Sn particles gradually decreased. Electrochemical tests showed that the solder alloy aged for 24 h exhibited the lowest corrosion current density, the largest Nyquist semicircle diameter, and the best corrosion resistance. However, a decline in the corrosion resistance of the solder was observed with further aging. Tensile testing revealed that the tensile strength of SAC305 decreased with increasing aging time, while the elongation was found to be improved.

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150℃时效Sn-3.0Ag-0.5Cu钎料合金的组织、腐蚀及力学性能

随着电子技术的进步，电子产品越来越多地部署在各种苛刻的环境中，如高温和腐蚀性液体。研究了Sn-3.0Ag-0.5Cu （SAC305）钎料合金在150℃时效240 h后的显微组织、耐蚀性和拉伸性能。结果表明，时效处理对合金的显微组织有显著影响。随着时效时间的延长，组织粗化更加明显，细小的Ag3Sn颗粒数量逐渐减少。电化学测试表明，时效24 h的钎料合金具有最低的腐蚀电流密度、最大的奈奎斯特半圆直径和最佳的耐蚀性。然而，随着进一步老化，观察到焊料的耐腐蚀性下降。拉伸试验表明，随着时效时间的延长，SAC305的抗拉强度降低，伸长率提高。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.