Effects of Ag shell morphology on sinter-bonding by thermo-compression of micron Cu@Ag/submicron Ag composite paste

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2025-05-11 DOI:10.1007/s10854-025-14848-2

Yeongjung Kim, Jong-Hyun Lee

{"title":"Effects of Ag shell morphology on sinter-bonding by thermo-compression of micron Cu@Ag/submicron Ag composite paste","authors":"Yeongjung Kim, Jong-Hyun Lee","doi":"10.1007/s10854-025-14848-2","DOIUrl":null,"url":null,"abstract":"<div><p>Ag-coated Cu (Cu@Ag) particles with antioxidant properties and price competitiveness are considered as fillers in sinter-bonding pastes for the die attachment of wide band-gap semiconductors at low temperature such as 250 ℃. To achieve the rapid sinter-bonding of Cu@Ag particles at 250 ℃, micron Cu@Ag particles with an Ag shell composed of numerous Ag nanoplatelets (ANP) were used, and the effect of Ag shell morphology on the sinter-bondability was confirmed by comparing with conventional micron Cu@Ag particles with a smooth surface (ASS). For the high packing densities of fillers, the composite particles were prepared by mixing them with submicron Ag particles in ratios of 5:5, 6:4, and 7:3. Sinter-bonding of pastes containing the ASS/Ag or ANP/Ag composite particles with different mixing ratio (SSA55, NPA55, NPA64, and NPA73) was conducted under 10 MPa for 1–10 min with nitrogen blowing. The bondline using NPA55 exhibited a near full-density microstructure and high shear strength (25.81 MPa) when sintered for a short time of 1 min, which was a much higher value than the 14.41 MPa of SSA55. These results demonstrate that rapid sinter-bonding at 250 ℃ can be achieved using novel micron Cu@Ag particles with large surface area and high surface energy.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 14","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14848-2","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

Ag-coated Cu (Cu@Ag) particles with antioxidant properties and price competitiveness are considered as fillers in sinter-bonding pastes for the die attachment of wide band-gap semiconductors at low temperature such as 250 ℃. To achieve the rapid sinter-bonding of Cu@Ag particles at 250 ℃, micron Cu@Ag particles with an Ag shell composed of numerous Ag nanoplatelets (ANP) were used, and the effect of Ag shell morphology on the sinter-bondability was confirmed by comparing with conventional micron Cu@Ag particles with a smooth surface (ASS). For the high packing densities of fillers, the composite particles were prepared by mixing them with submicron Ag particles in ratios of 5:5, 6:4, and 7:3. Sinter-bonding of pastes containing the ASS/Ag or ANP/Ag composite particles with different mixing ratio (SSA55, NPA55, NPA64, and NPA73) was conducted under 10 MPa for 1–10 min with nitrogen blowing. The bondline using NPA55 exhibited a near full-density microstructure and high shear strength (25.81 MPa) when sintered for a short time of 1 min, which was a much higher value than the 14.41 MPa of SSA55. These results demonstrate that rapid sinter-bonding at 250 ℃ can be achieved using novel micron Cu@Ag particles with large surface area and high surface energy.

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银壳形貌对微米Cu@Ag/亚微米银复合浆料热压烧结键合的影响

银包覆Cu （Cu@Ag）颗粒具有抗氧化性能和价格竞争力，可作为低温（250℃）宽带隙半导体晶片连接烧结浆料的填料。为了在250℃下实现Cu@Ag颗粒的快速烧结结合，采用了由多个银纳米片（ANP）组成的银壳微米Cu@Ag颗粒，并通过与表面光滑的微米Cu@Ag颗粒（ASS）的比较，证实了银壳形貌对烧结结合性能的影响。针对填料填充密度高的特点，将其与亚微米银颗粒按5:5、6:4和7:3的比例混合制备复合颗粒。采用氮吹法，在10 MPa条件下烧结1 ~ 10 min，对不同混合比例（SSA55、NPA55、NPA64、NPA73）的ASS/Ag或ANP/Ag复合颗粒膏体进行烧结。NPA55烧结后的结合线具有接近全密度的微观组织和较高的抗剪强度（25.81 MPa），远高于SSA55烧结后的14.41 MPa。这些结果表明，使用具有大表面积和高表面能的新型微米级Cu@Ag颗粒可以在250℃下实现快速烧结键合。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.