Performance and reliability of nanoparticle-reinforced lead-free solder composite joints

IF 3.5 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Kaiming Liang, Wenqiang Wan, Xiangdong Ding, Peng He, Shuye Zhang
{"title":"Performance and reliability of nanoparticle-reinforced lead-free solder composite joints","authors":"Kaiming Liang,&nbsp;Wenqiang Wan,&nbsp;Xiangdong Ding,&nbsp;Peng He,&nbsp;Shuye Zhang","doi":"10.1007/s10853-025-10882-x","DOIUrl":null,"url":null,"abstract":"<div><p>Sn-based solders enhanced with nanoparticles have garnered extensive attention in recent years due to their excellent properties. The doping of various nanomaterials offers endless possibilities for the development of these composite solders. This review focuses on reviewing the properties and reliability of nanoparticle-enhanced Sn-based solder interconnects in recent years, introducing the concept and material types of nano-enhanced solders, and systematically examining the impact of various nano-reinforcement particles on solder joint performance, with corresponding mechanisms proposed for different situations. Additionally, it comprehensively considers the effects of different reliability tests on joint performance, with comparisons and analyses conducted. Finally, scientific challenges, limitations, and potential future breakthroughs in composite solder joints are proposed based on the current research. This review aims to provide comprehensive theoretical guidance for the future of composite soldering, enhancing the potential for industrial applications.</p></div>","PeriodicalId":645,"journal":{"name":"Journal of Materials Science","volume":"60 17","pages":"7091 - 7116"},"PeriodicalIF":3.5000,"publicationDate":"2025-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s10853-025-10882-x","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

Sn-based solders enhanced with nanoparticles have garnered extensive attention in recent years due to their excellent properties. The doping of various nanomaterials offers endless possibilities for the development of these composite solders. This review focuses on reviewing the properties and reliability of nanoparticle-enhanced Sn-based solder interconnects in recent years, introducing the concept and material types of nano-enhanced solders, and systematically examining the impact of various nano-reinforcement particles on solder joint performance, with corresponding mechanisms proposed for different situations. Additionally, it comprehensively considers the effects of different reliability tests on joint performance, with comparisons and analyses conducted. Finally, scientific challenges, limitations, and potential future breakthroughs in composite solder joints are proposed based on the current research. This review aims to provide comprehensive theoretical guidance for the future of composite soldering, enhancing the potential for industrial applications.

纳米颗粒增强无铅焊料复合接头的性能和可靠性
纳米粒子增强锡基钎料由于其优异的性能近年来引起了广泛的关注。各种纳米材料的掺杂为这些复合钎料的发展提供了无限的可能性。本文综述了近年来纳米增强锡基焊料互连的性能和可靠性,介绍了纳米增强焊料的概念和材料类型,系统研究了各种纳米增强颗粒对焊点性能的影响,并针对不同情况提出了相应的机制。综合考虑了不同可靠性试验对接头性能的影响,并进行了比较分析。最后,基于目前的研究,提出了复合焊点的科学挑战、局限性和未来可能的突破。本文旨在为今后复合焊接技术的发展提供全面的理论指导,增强其工业应用潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Materials Science
Journal of Materials Science 工程技术-材料科学:综合
CiteScore
7.90
自引率
4.40%
发文量
1297
审稿时长
2.4 months
期刊介绍: The Journal of Materials Science publishes reviews, full-length papers, and short Communications recording original research results on, or techniques for studying the relationship between structure, properties, and uses of materials. The subjects are seen from international and interdisciplinary perspectives covering areas including metals, ceramics, glasses, polymers, electrical materials, composite materials, fibers, nanostructured materials, nanocomposites, and biological and biomedical materials. The Journal of Materials Science is now firmly established as the leading source of primary communication for scientists investigating the structure and properties of all engineering materials.
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