Enhancing the gas sensing of porous silicon by surface modification using non-thermal plasma

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Noor Dhaief Hayif, Hasan A. Hadi, Intesar H. Hashim
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Abstract

This study used a non-thermal atmospheric argon plasma jet (NTAAPJ) as an innovative technique for treating and altering porous silicon surfaces (PSi) and enhancing their performance as nitrogen dioxide (NO2) gas sensors. To prepare the PSi layers, we used photo-electrochemical etching (PECE). To treat the surface of porous silicon samples for different durations, the NTAAPJ was used at a plasma voltage of 18 kV. The influence of treatment on the structural and morphological properties of PSi was studied. X-ray diffraction (XRD) analysis revealed a shift in the (111) diffraction peak to a lower angle, indicating a reduction in internal microstrain. Additionally, the crystalline size increased from 28.6 to 54.6 nm after 16 min of treatment, suggesting enhanced crystal growth and improved structural ordering. Field-emission scanning electron microscopy (FE-SEM) and atomic force microscopy (AFM) images revealed an expansion of pore diameter from 1.1 to 2.4 μm and a porosity percentage increase from 11 to 75% after treatment. At the same time, surface regularity and roughness values improved, indicating a positive effect on surface structure and physical properties. Raman spectra further indicated improved crystallinity, with a blue shift in the Raman band and increased intensity as the time of treatment increases. Meanwhile, the Fourier transform infrared (FTIR) results illustrate that the plasma treatment did not alter the peak position or create new chemical bonds. Energy dispersive spectroscopy (EDS) analysis indicated that the PSi includes silicon, oxygen, and carbon. The oxygen percentage increased from 0.3% to 21.1%, and the carbon percentage decreased from 21 to 14% after treatment. The sensitivity of both treated and untreated samples to 60 ppm of nitrogen dioxide (NO2) was evaluated at three distinct working temperatures: room temperature (RT), 75 °C, and 125 °C. The samples’ maximum sensitivity was recorded at 75 °C, indicating its superiority over other temperatures in gas detection. The results demonstrated a progressive improvement in sensing capability as the treatment period increased.

非热等离子体表面改性提高多孔硅的气敏性能
本研究采用非热常压氩等离子体射流(NTAAPJ)作为一种创新技术来处理和改变多孔硅表面(PSi),并提高其作为二氧化氮(NO2)气体传感器的性能。为了制备PSi层,我们使用了光电电化学蚀刻(PECE)。为了对多孔硅样品进行不同时间的表面处理,在18 kV的等离子体电压下使用了NTAAPJ。研究了处理对PSi结构和形态性能的影响。x射线衍射(XRD)分析显示(111)衍射峰向一个较低的角度移动,表明内部微应变减小。处理16 min后,晶体尺寸从28.6 nm增加到54.6 nm,表明晶体生长增强,结构有序。场发射扫描电镜(FE-SEM)和原子力显微镜(AFM)分析结果显示,处理后材料的孔径从1.1 μm扩大到2.4 μm,孔隙率从11%提高到75%。同时,表面的规整性和粗糙度值也有所提高,表明对表面结构和物理性能有积极的影响。拉曼光谱进一步表明结晶度有所提高,随着处理时间的延长,拉曼波段出现蓝移,强度增加。同时,傅里叶变换红外(FTIR)结果表明,等离子体处理没有改变峰的位置,也没有产生新的化学键。能谱(EDS)分析表明PSi包括硅、氧和碳。处理后,氧含量由0.3%提高到21.1%,碳含量由21%降低到14%。在三种不同的工作温度:室温(RT)、75°C和125°C下,评估了处理和未处理样品对60 ppm二氧化氮(NO2)的敏感性。在75°C时记录了样品的最大灵敏度,表明其在气体检测方面优于其他温度。结果表明,随着处理时间的延长,感知能力逐渐提高。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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