Thermal interface materials: A promising solution for passive heat dissipation in electronic appliances

Abstract

The rapid progress of wireless technology, accompanied by the continuous miniaturization of electronic devices, has significantly increased power density, posing serious challenges to thermal management. Upholding stable thermal performance in compact devices requires highly efficient thermal interface materials (TIMs) having the capability of reliable heat dissipation. This review critically analyzes the main categories of TIMs used in electronic packaging cooling, highlighting their thermal characteristics, operational limitations, and common issues, such as pump-out and phase separation in conventional materials (greases, gels, adhesives, and thermal pads). Special attention is paid to nano-enhanced phase change materials (NePCMs), which combine the high latent heat of PCMs with the superior thermal conductivity of embedded nanoparticles e.g., carbon, metals. The review is organized into sections covering: (i) the fundamental properties of conventional TIMs and NePCMs, (ii) the types of nanoparticles used in various classes of PCMs and their effects on thermophysical properties like thermal conductivity, latent heat capacity, melting point, and (iii) the main challenges related to the integration of NePCMs in electronic packaging. In conclusion, the need for advanced optimization strategies is highlighted to fully exploit the potential of NePCMs in the thermal management of future high-energy-density devices.