Performance study of UV micro-LEDs with AlGaN quantum dots and transparent tunnel junction

Yun-Cheng Hsu , Ching-Ho Tien , Yun-Han Chang , Sunanda Mitra , Sankesh Shetty , Sébastien Chenot , Mohamed Al Khalfioui , Hao-Chung Kuo , Chi-Wai Chow , Chia-Yen Huang , Julien Brault , Ray-Hua Horng
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Abstract

It is well known that the size of deep ultraviolet (DUV) micro LED (μLEDs) decreases, although bandwidth improves, the optical power drops sharply, severely limiting the application of DUV μLEDs in optical communication. This study focused on the fabrication of DUV μLED with 10 μm × 10 μm dimenstion, utilizing molecular beam epitaxy (MBE) technology to grow AlGaN quantum dots (QD) and improve the stress in the quantum dot structure through stress engineering, thereby enhancing the light emission efficiency. To improve the ohmic contact in the p-type region, a tunneling structure is designed and incorporated, which helps increase carrier injection efficiency and further optimize the electrical performance of device. Additionally, by combining neutral particle beam etching (NBE) technology, the μLED is precisely processed, suppressing the processing damage that typically reduces light emission efficiency in conventional dry etching methods. Test results demonstrate that the integration of these technologies significantly improves the optoelectronic properties of the DUV μLED with 10 μm × 10 μm dimenstion, providing a reliable technical solution for DUV communication applications.
具有AlGaN量子点和透明隧道结的紫外微型led的性能研究
众所周知,随着深紫外(DUV)微LED (μLED)尺寸的减小,虽然带宽有所提高,但光功率却急剧下降,严重限制了DUV μLED在光通信中的应用。本研究重点制备了10 μm × 10 μm尺寸的DUV μLED,利用分子束外延(MBE)技术生长AlGaN量子点(QD),并通过应力工程改善量子点结构中的应力,从而提高发光效率。为了改善p型区的欧姆接触,设计并加入了隧道结构,提高了载流子注入效率,进一步优化了器件的电气性能。此外,通过结合中性粒子束刻蚀(NBE)技术,μLED被精确地加工,抑制了传统干刻蚀方法中通常会降低光发射效率的加工损伤。测试结果表明,这些技术的集成显著提高了10 μm × 10 μm尺寸DUV μLED的光电性能,为DUV通信应用提供了可靠的技术解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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