Microstructure evolution and growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under ultrasonic waves

IF 2.5 4区材料科学 Q2 METALLURGY & METALLURGICAL ENGINEERING

Welding in the World Pub Date : 2025-01-18 DOI:10.1007/s40194-025-01926-6

Hongwei Niu, Hong Bian, Jian Wang, Xiaoguo Song, Hongyun Zhao

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Abstract

The microstructure evolution and growth kinetics of Cu₆Sn₅ intermetallic compound (IMC) in a Cu/Sn/Cu interconnection during ultrasonic-assisted transient liquid phase (TLP) soldering were studied. Being different from the symmetrical growth during isothermal aging without ultrasonic waves (USW), highly asymmetrical growth of Cu₆Sn₅ at the upper and lower Sn/Cu interfaces was observed with USW. Cu₆Sn₅ grains exhibited scallop-type morphology and were discrete at the upper interface; while that at the lower Sn/Cu interface exhibited column-type morphology and were conterminous at the lower interface. USW induced Cu atom migration from the upper Cu surface to the lower interface, providing a sufficient atomic flux for rapid Cu₆Sn₅ formation at the lower interface and creating cavitation pits on the upper Cu surface. A growth model was developed to explain the Cu₆Sn₅ IMC kinetics, suggesting a reaction-controlled growth mechanism.

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超声作用下Cu/Sn/Cu互连液固界面Cu6Sn5金属间化合物的微观结构演变及生长动力学

研究了超声辅助瞬态液相（TLP）焊接Cu/Sn/Cu界面中Cu6Sn5金属间化合物（IMC）的微观结构演变和生长动力学。与无超声波等温时效（USW）时的对称生长不同，超声时效（USW）下、上、下Sn/Cu界面处Cu6Sn5的生长高度不对称。Cu6Sn5晶粒呈扇贝状，在上部界面处呈离散状；而下Sn/Cu界面处则呈现柱状形态，且下界面处相邻。USW诱导Cu原子从上Cu表面向下Cu界面迁移，为下Cu界面快速形成Cu6Sn5提供了足够的原子通量，并在上Cu表面形成空化坑。建立了一个生长模型来解释Cu6Sn5 IMC动力学，提出了一个反应控制的生长机制。

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来源期刊

Welding in the World METALLURGY & METALLURGICAL ENGINEERING-

CiteScore

4.20

自引率

14.30%

发文量

181

审稿时长

6-12 weeks

期刊介绍： The journal Welding in the World publishes authoritative papers on every aspect of materials joining, including welding, brazing, soldering, cutting, thermal spraying and allied joining and fabrication techniques.