High-strength heterostructure joint of 6063Al alloys manufactured by ultrasonic-assisted TLP bonding using an Zn/Mg/Zn composite interlayer

IF 2.4 4区材料科学 Q2 METALLURGY & METALLURGICAL ENGINEERING

Welding in the World Pub Date : 2025-03-01 DOI:10.1007/s40194-025-01997-5

Yuanming Zhao, Keheng Pu, Guanhong Liu, Pu Zhao, Zhengwei Li, Zhiwu Xu, Jiuchun Yan

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引用次数: 0

Abstract

As the most advanced development of low-temperature and high-strength diffusion bonding of Al alloys, the lowest joining temperature of ultrasonic-assisted transient liquid phase (U-TLP) bonding of Al alloys can only be limited to 390 °C using Zn interlayer. Further reduction of bonding temperature is an urgent need to avoid strength loss of base metal. In this work, U-TLP bonding of 6063Al alloy only required 350 °C, which was achieved in the air by a newly designed composite interlayer of Zn/Mg/Zn. The surface oxide films on metals were broken by the cavitation effect of ultrasonic in Mg-Zn eutectic liquid phase. The joint composition undergone a transition from MgZn₂ + η-Zn to MgZn₂ + η-Zn + Zn-Al eutectoid to MgZn₂ + Zn-Al eutectoid. Final joint of MgZn₂ + Zn-Al eutectoid with a strength coefficient of 100% was obtained only required an ultrasonic vibration of 180 s. The initial joint was a brittle structure composed by the MgZn₂ and the η-Zn phases, and it finally transformed to a reinforced structure with a network shape of the Zn-Al eutectoid-coated dispersed MgZn₂ particles. The joint was strengthened due to the Zn-Al eutectoid phase and MgZn₂ hard particles with differences in hardness based on the heterogeneous deformation strengthening theory.

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用Zn/Mg/Zn复合中间层制备6063Al合金高强度异质结构接头

超声辅助瞬态液相（U-TLP）键合作为铝合金低温高强扩散键合的最新进展，采用Zn中间层将铝合金的最低连接温度限制在390℃。进一步降低粘接温度是避免母材强度损失的迫切需要。在这项工作中，6063Al合金的U-TLP键合只需要350℃，这是通过新设计的Zn/Mg/Zn复合中间层在空气中实现的。在Mg-Zn共晶液相中，超声波的空化作用破坏了金属表面的氧化膜。接头组成经历了从MgZn2 + η-Zn到MgZn2 + η-Zn + Zn-Al共析再到MgZn2 + Zn-Al共析的转变过程。超声振动180 s即可获得强度系数为100%的MgZn2 + Zn-Al共晶最终接头。初始连接是由MgZn2和η-Zn相组成的脆性结构，最终转变为由Zn-Al共析包覆分散MgZn2颗粒组成的网状强化结构。基于非均质变形强化理论，采用不同硬度的Zn-Al共晶相和MgZn2硬颗粒对接头进行强化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Welding in the World METALLURGY & METALLURGICAL ENGINEERING-

CiteScore

4.20

自引率

14.30%

发文量

181

审稿时长

6-12 weeks

期刊介绍： The journal Welding in the World publishes authoritative papers on every aspect of materials joining, including welding, brazing, soldering, cutting, thermal spraying and allied joining and fabrication techniques.