Experimental investigations into the effect of low temperature empowerment on the grooves quality of ITO conductive glass using by micro grinding

IF 2.5 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Xi Chu, Yin Liu, Xingwei Sun, Yuxuan Lu, Haosheng Dong, Fei Pan, Wei Xu, Zewei Yuan, Shibo Mu, Sheng Qu
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引用次数: 0

Abstract

This paper conducted a single-factor experiments of micro-scale grinding of ITO conductive glass, changing the feed speed, grinding depth and spindle speed. The effects of temperature reduction on the micromorphology, surface roughness and transmittance of the machined surface were analyzed by comparing the experiments at normal temperature. The results show that different areas of the groove present different morphologies, and there are obvious scratch areas on the side walls of the groove. The removal mode of the glass substrate is mainly the evolution and interweaving of the initial micro-damage. The micro-morphology is mainly pits and cracks of different sizes. The indium tin oxide film is mostly flaky and curled. The reduction of processing temperature improves the hardness and strength of the material, inhibits the further evolution of damage when the processing parameters change, and improves the surface quality. Low-temperature grinding produces more powder chips with smaller size. The appropriate amount of chip accumulation can improve the processing quality and tool wear. The transmittance of light of different wavelengths is sensitive to temperature changes to different degrees. The transmittance of ultraviolet and visible light of the workpiece is improved after low-temperature processing. The research reveals the low-temperature grinding characteristics of ITO conductive glass based on experiments, which is helpful to optimize the design and implementation of low-temperature grinding process, and proves that it is a feasible way to improve the processing quality of ITO conductive glass by mainly removing brittleness.

低温强化对微磨ITO导电玻璃沟槽质量影响的实验研究
本文通过改变进给速度、磨削深度和主轴转速,进行了ITO导电玻璃微尺度磨削的单因素实验。通过与常温下的实验对比,分析了温度降低对加工表面微观形貌、表面粗糙度和透光率的影响。结果表明:沟槽的不同区域呈现不同的形貌,沟槽侧壁存在明显的划痕区;玻璃基板的去除模式主要是初始微损伤的演化与交织。微观形貌主要为不同大小的凹坑和裂纹。氧化铟锡薄膜大多呈片状和卷曲状。加工温度的降低提高了材料的硬度和强度,抑制了加工参数变化时损伤的进一步演变,提高了表面质量。低温磨削产生的粉屑多,粒度小。适量的积屑可以提高加工质量,减少刀具磨损。不同波长光的透光率对温度变化的敏感程度不同。工件经过低温加工后,紫外线和可见光的透射率提高。本研究通过实验揭示了ITO导电玻璃的低温磨削特性,有助于优化低温磨削工艺的设计与实现,并证明以去除脆性为主是提高ITO导电玻璃加工质量的可行途径。
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来源期刊
Applied Physics A
Applied Physics A 工程技术-材料科学:综合
CiteScore
4.80
自引率
7.40%
发文量
964
审稿时长
38 days
期刊介绍: Applied Physics A publishes experimental and theoretical investigations in applied physics as regular articles, rapid communications, and invited papers. The distinguished 30-member Board of Editors reflects the interdisciplinary approach of the journal and ensures the highest quality of peer review.
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