Fabio C. Nunes , Patryck A. Lançoni , Gustavo H.M. Gomes , Karina F. Santos , Ester Y. Nagata , João V. Campos , Izabel C.F. Moraes , Juliana K.M.B. Daguano , Eliria M.J.A. Pallone
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引用次数: 0
Abstract
Flash sintering is an innovative technique that employs an electric field to significantly accelerate the sintering process while reducing the furnace temperature needed for sintering, offering reduced processing times and energy consumption. This approach enables the rapid consolidation of ceramic materials within seconds, presenting new opportunities for advanced manufacturing. One promising yet not fully explored application is the densification of 3D-printed porous structures, such as scaffolds. In this study, we investigated, for the first time, the application of flash sintering to 3 mol% yttria-stabilized zirconia (3YSZ) scaffolds fabricated via material extrusion. The scaffolds were produced using an ink comprising 70 wt% ceramic particles, poly(ethylene glycol) as a binder, and Laponite nanoclay as a rheological agent. After debinding, flash sintering was performed using an electric field of 80 V cm−1 to consolidate the scaffolds. The rheological properties of the ink were characterized to ensure optimal printability, while the scaffold morphology was analyzed across various regions. The ink exhibited a shear-thinning behavior, ideal for material extrusion processes. Flash sintering resulted in rapid densification of the scaffolds at lower temperatures (1000 °C/60s) compared to conventional sintering methods (1500 °C/2h). Finite element analysis was employed to model the temperature evolution of the scaffolds during flash sintering. The final scaffolds demonstrated uniform grain size , interconnected porosity, and a robust porous network, emphasizing the potential of flash sintering for fabricating complex-shaped ceramics with tailored microstructures.
闪速烧结是一种创新技术,它利用电场显著加快烧结过程,同时降低烧结所需的炉温,减少加工时间和能耗。这种方法可以在几秒钟内快速固化陶瓷材料,为先进制造提供新的机会。3d打印多孔结构(如支架)的致密化是一个有前景但尚未充分开发的应用。在本研究中,我们首次研究了闪速烧结在材料挤压法制备3mol %氧化钇稳定氧化锆(3YSZ)支架中的应用。该支架使用含有70%陶瓷颗粒的油墨,聚乙二醇作为粘合剂,拉脱石纳米粘土作为流变性剂。脱粘后,在80 V cm−1的电场下进行闪蒸烧结以巩固支架。表征了油墨的流变特性,以确保最佳的印刷性,同时分析了支架在不同区域的形态。油墨表现出剪切变薄的行为,理想的材料挤压过程。与传统烧结方法(1500°C/2h)相比,闪速烧结在较低的温度(1000°C/60s)下导致支架快速致密化。采用有限元方法模拟了闪烧过程中支架的温度演变过程。最终的支架显示出均匀的晶粒尺寸,相互连接的孔隙率和坚固的多孔网络,强调了闪烧在制造具有定制微结构的复杂形状陶瓷方面的潜力。
期刊介绍:
Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties.
Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour.
Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.