Atomically precise yet rapid micromachining via projection-based femtosecond laser ablation

IF 1.9 Q3 ENGINEERING, MANUFACTURING
Rugile Zilenaite, Harnjoo Kim, Sourabh K. Saha
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引用次数: 0

Abstract

It is extremely challenging to achieve atomic scale depth resolutions with top-down micromachining techniques while simultaneously achieving high processing rates. Here, we have overcome this challenge by projecting patterned light sheets of spatio-temporally focused femtosecond laser. It has enabled ablation-based micromachining of thin gold films with depths of cut between 7–14 nm, depth resolvability of 1–3 atoms, and linewidths smaller than 500 nm. Furthermore, we have achieved a processing rate of 9 mm2/s, which is 10–105 times faster than the state-of-art. Thus, our process enables rapid and atomically precise machining of metal thin films.

Abstract Image

通过基于投影的飞秒激光烧蚀进行原子精确而快速的微加工
在实现高加工速率的同时,用自上而下的微加工技术实现原子尺度深度分辨率是极具挑战性的。在这里,我们通过投射时空聚焦飞秒激光的图案光片来克服这一挑战。它实现了基于烧蚀的薄金薄膜的微加工,切割深度在7 - 14nm之间,深度分辨率为1-3个原子,线宽小于500nm。此外,我们还实现了9 mm2/s的处理速率,比目前的水平快10-105倍。因此,我们的工艺可以实现金属薄膜的快速和原子精确加工。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Manufacturing Letters
Manufacturing Letters Engineering-Industrial and Manufacturing Engineering
CiteScore
4.20
自引率
5.10%
发文量
192
审稿时长
60 days
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