66–76 GHz High-Isolation 1-D Wide-Angle Scanning Phased Array Antenna With Bent-Wall Structures

IF 3.7 2区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jinghao Li;Wanchen Yang;Yuji Liu;Wenjie Feng;Quan Xue;Wenquan Che
{"title":"66–76 GHz High-Isolation 1-D Wide-Angle Scanning Phased Array Antenna With Bent-Wall Structures","authors":"Jinghao Li;Wanchen Yang;Yuji Liu;Wenjie Feng;Quan Xue;Wenquan Che","doi":"10.1109/LAWP.2025.3529596","DOIUrl":null,"url":null,"abstract":"In this letter, a millimeter-wave wide-angle scanning phased array antenna based on low-temperature co-fired ceramics is proposed. First, metal grounded vias and metal plates are introduced around the patch antenna to form a bent wall, which can broaden the E-plane beamwidth from 100° to 118° at 66 GHz to 76 GHz. Based on the wide-beam element, a 4 × 4 array is constructed with a spacing of only 0.38λ<sub>0</sub>, and a Π-shaped decoupling structure is introduced between adjacent elements to construct a planar coupling cancelation path with equal magnitude and opposite phase, which can increase the isolation from 15 dB to 20 dB. In addition, two rows of dummy elements are loaded along the E-plane on both sides of the array to improve the maximum scanning angle to ±71°, with the gain attenuation within 2 dB. The antenna prototypes are fabricated and the measured and simulated results are highly consistent, indicating the proposed phased array antenna is a favorable candidate for 6G applications.","PeriodicalId":51059,"journal":{"name":"IEEE Antennas and Wireless Propagation Letters","volume":"24 5","pages":"1193-1197"},"PeriodicalIF":3.7000,"publicationDate":"2025-01-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Antennas and Wireless Propagation Letters","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10841982/","RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

In this letter, a millimeter-wave wide-angle scanning phased array antenna based on low-temperature co-fired ceramics is proposed. First, metal grounded vias and metal plates are introduced around the patch antenna to form a bent wall, which can broaden the E-plane beamwidth from 100° to 118° at 66 GHz to 76 GHz. Based on the wide-beam element, a 4 × 4 array is constructed with a spacing of only 0.38λ0, and a Π-shaped decoupling structure is introduced between adjacent elements to construct a planar coupling cancelation path with equal magnitude and opposite phase, which can increase the isolation from 15 dB to 20 dB. In addition, two rows of dummy elements are loaded along the E-plane on both sides of the array to improve the maximum scanning angle to ±71°, with the gain attenuation within 2 dB. The antenna prototypes are fabricated and the measured and simulated results are highly consistent, indicating the proposed phased array antenna is a favorable candidate for 6G applications.
弯曲壁结构66-76 GHz高隔离一维广角扫描相控阵天线
本文提出了一种基于低温共烧陶瓷的毫米波广角扫描相控阵天线。首先,在贴片天线周围引入金属接地过孔和金属板形成弯壁,可以在66 GHz至76 GHz频段将e平面波束宽度从100°扩大到118°。在宽波束单元的基础上,构建了间距仅为0.38λ0的4 × 4阵列,并在相邻单元之间引入Π-shaped去耦结构,构建了等幅度、相反相位的平面耦合抵消路径,将隔离度从15 dB提高到20 dB。此外,在阵列两侧的e平面上加载两排虚拟元件,将最大扫描角度提高到±71°,增益衰减在2 dB以内。制作了天线样机,测量和仿真结果高度一致,表明所提出的相控阵天线是6G应用的理想选择。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
8.00
自引率
9.50%
发文量
529
审稿时长
1.0 months
期刊介绍: IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.
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