Changhong Linghu , Wentao Mao , Haoyu Jiang , Huajian Gao , K. Jimmy Hsia
{"title":"Rubber-to-glass adhesion between a rigid sphere and a shape memory polymer substrate of finite thickness","authors":"Changhong Linghu , Wentao Mao , Haoyu Jiang , Huajian Gao , K. Jimmy Hsia","doi":"10.1016/j.ijsolstr.2025.113431","DOIUrl":null,"url":null,"abstract":"<div><div>Shape memory polymers (SMPs) are emerging as innovative smart adhesive materials with broad application potential. Compared to conventional elastomeric adhesives, SMP adhesives are distinguished by the so-called rubber-to-glass (R2G) adhesion, which involves contact in the rubbery state followed by detachment in the glassy state. This process, through a shape-locking effect, enhances adhesion strength by more than an order of magnitude compared to conventional adhesive contact. Here, we investigate the fundamental problem of a rigid sphere undergoing R2G adhesion with an SMP substrate of finite thickness through experiments, finite element (FE) simulations, and theoretical modeling. It is demonstrated that during press-in, the contact problem can be modeled as a rigid oblate spheroid contacting an infinite substrate, while the pull-off process can be described by a modified ball-and-socket model. These equivalent models yield practically useful analytical solutions for the contact radius during press-in and the R2G adhesion force during pull-off. A critical thickness-to-contact-radius ratio of around 5 is identified, below which the thickness effect becomes significant. These insights provide valuable guidance for the design and application of SMP-based smart adhesives.</div></div>","PeriodicalId":14311,"journal":{"name":"International Journal of Solids and Structures","volume":"317 ","pages":"Article 113431"},"PeriodicalIF":3.4000,"publicationDate":"2025-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Solids and Structures","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0020768325002173","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MECHANICS","Score":null,"Total":0}
引用次数: 0
Abstract
Shape memory polymers (SMPs) are emerging as innovative smart adhesive materials with broad application potential. Compared to conventional elastomeric adhesives, SMP adhesives are distinguished by the so-called rubber-to-glass (R2G) adhesion, which involves contact in the rubbery state followed by detachment in the glassy state. This process, through a shape-locking effect, enhances adhesion strength by more than an order of magnitude compared to conventional adhesive contact. Here, we investigate the fundamental problem of a rigid sphere undergoing R2G adhesion with an SMP substrate of finite thickness through experiments, finite element (FE) simulations, and theoretical modeling. It is demonstrated that during press-in, the contact problem can be modeled as a rigid oblate spheroid contacting an infinite substrate, while the pull-off process can be described by a modified ball-and-socket model. These equivalent models yield practically useful analytical solutions for the contact radius during press-in and the R2G adhesion force during pull-off. A critical thickness-to-contact-radius ratio of around 5 is identified, below which the thickness effect becomes significant. These insights provide valuable guidance for the design and application of SMP-based smart adhesives.
期刊介绍:
The International Journal of Solids and Structures has as its objective the publication and dissemination of original research in Mechanics of Solids and Structures as a field of Applied Science and Engineering. It fosters thus the exchange of ideas among workers in different parts of the world and also among workers who emphasize different aspects of the foundations and applications of the field.
Standing as it does at the cross-roads of Materials Science, Life Sciences, Mathematics, Physics and Engineering Design, the Mechanics of Solids and Structures is experiencing considerable growth as a result of recent technological advances. The Journal, by providing an international medium of communication, is encouraging this growth and is encompassing all aspects of the field from the more classical problems of structural analysis to mechanics of solids continually interacting with other media and including fracture, flow, wave propagation, heat transfer, thermal effects in solids, optimum design methods, model analysis, structural topology and numerical techniques. Interest extends to both inorganic and organic solids and structures.