Wetting and brazing of (HfTaZrNbTi)B2 and (HfTaZrNbTi)C High-Entropy Ceramics by AgCuTi filler

IF 2.9 Q1 MATERIALS SCIENCE, CERAMICS

Open Ceramics Pub Date : 2025-04-30 DOI:10.1016/j.oceram.2025.100792

Naser Hosseini , Fabrizio Valenza , Zdeněk Chlup , Sofia Gambaro , Carla Malinverni , Valentina Casalegno , Alexandra Kovalčíková , Monika Tatarková , Ivo Dlouhý , Peter Tatarko

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Abstract

The wetting behaviour of (HfTaZrNbTi)B₂ high entropy boride (HEB) and (HfTaZrNbTi)C high-entropy carbide (HEC) with molten Cu and AgCuTi alloy was investigated via the sessile drop method under an Ar/H₂ atmosphere. Pure Cu exhibited non-reactive wetting with contact angles ∼ 120° on HEB and ∼ 126° on HEC. In contrast, AgCuTi alloy showed strong reactive wetting (contact angle ≤ 17°), primarily driven by reactive Ti. The reaction layer was notably thicker for the HEC/AgCuTi system. Due to the better wetting behaviour and high-temperature interactions with the ceramic substrates, AgCuTi alloy was employed as a filler to braze HEB and HEC using pressure-less Field Assisted Sintering Technique (FAST). The resulting joints demonstrated high apparent shear strength of 176 ± 39 MPa for HEC and 116 ± 38 MPa for HEB, exceeding the strength of the base materials in both cases.

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AgCuTi填料润湿和钎焊（HfTaZrNbTi）B2和（HfTaZrNbTi）C高熵陶瓷

在Ar/H2气氛下，采用固滴法研究了（HfTaZrNbTi） b2高熵硼化物（HEB）和（HfTaZrNbTi）C高熵碳化物（HEC）与熔融Cu和AgCuTi合金的润湿行为。纯Cu表现出非反应性润湿，接触角在HEB上为~ 120°，在HEC上为~ 126°。而AgCuTi合金表现出较强的反应性润湿（接触角≤17°），主要由反应Ti驱动。HEC/AgCuTi体系的反应层明显较厚。由于AgCuTi合金具有良好的润湿性能和与陶瓷衬底的高温相互作用，因此采用无压场辅助烧结技术（FAST）将其作为钎料钎焊HEB和HEC。所得到的节理显示出较高的表观抗剪强度，HEC为176±39 MPa， HEB为116±38 MPa，超过了两种基材的强度。

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