Electroless Plating of Copper on Laser-Induced Graphene for Flexible Hybrid Electronic Applications (Adv. Mater. Technol. 9/2025)

IF 6.4 3区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Advanced Materials Technologies Pub Date : 2025-05-05 DOI:10.1002/admt.202570046

Attila Rektor, Josh Eixenberger, Tony Valayil Varghese, Brian Cummings, Michael Curtis, Nicholas Mckibben, John Timler, David Estrada

引用次数: 0

Abstract

Flexible Hybrid Electronics

In article number 2401901, David Estrada and co-workers demonstrate a new approach to flexible PCB manufacturing. Through the use of Pd nanoparticle catalysts embedded in laser-induced graphene, the electroless plating of copper traces enables a simple and innovative approach to advance flexible hybrid electronics research and manufacturing processes. Image credit: Alex Jerez, Scientific Illustrator.

Abstract Image

查看原文本刊更多论文

柔性混合电子应用中激光诱导石墨烯化学镀铜的研究[j]。抛光工艺。9/2025)

柔性混合电子在文章编号2401901中，David Estrada和同事展示了一种柔性PCB制造的新方法。通过使用嵌入在激光诱导石墨烯中的钯纳米颗粒催化剂，化学镀铜痕迹可以采用一种简单而创新的方法来推进柔性混合电子研究和制造工艺。图片来源：Alex Jerez，科学插画师。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Advanced Materials Technologies Materials Science-General Materials Science

CiteScore

10.20

自引率

4.40%

发文量

566

期刊介绍： Advanced Materials Technologies Advanced Materials Technologies is the new home for all technology-related materials applications research, with particular focus on advanced device design, fabrication and integration, as well as new technologies based on novel materials. It bridges the gap between fundamental laboratory research and industry.