Finite element modeling analysis of misalignment impact on simulated electrical RC in scaling hybrid bonding pairs

Abstract

During the scaling down of hybrid bonding pairs, controllable misalignment is particularly important for ensuring remarkable electrical performance. This article presents the finite element modeling methodology to preview the significance of misalignment on resistance and capacitance values. Design parameters such as the via array, pad size, shape, and asymmetric structure are comprehensively considered. The results show that the electrical properties of interconnects at the small pitch is more sensitive to misalignment. The via array affects the current distribution serving as the inter-metal connection channel. The size and shape of the pad directly determine the effective contact area and effective space under various misalignment. The alignment error redundancy provided by the asymmetric structure is an option to alleviate the problem. This work contributes to understanding the impact weight of misalignment on electrical performance under different design conditions and formulating appropriate alignment rules.