Nicole Pellizzon, Berin Šeta, Carl Sander Kruse, Roozbeh Salajeghe, Jon Spangenberg
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引用次数: 0
Abstract
Volumetric additive manufacturing provides many advantages over more traditional layer-based additive manufacturing methods by permitting support-free printing with isotropic material properties. However, accurate geometry reproduction remains a challenge. This work presents two models to investigate the contributions of thermal strains and chemical shrinkage to parts made via tomographic volumetric additive manufacturing. A thermal model, with invariant material properties and uniform cure progression, reproduces similar magnitude deformations to those seen experimentally. Through a parameter study and partial least squares regression, for a target cube geometry, deformations are found to be dominated by the heat transfer coefficient. A second model investigates non-uniform chemical shrinkage predicting smaller deformations but better capturing the deformed shape. This work concludes that a combination of primarily thermal strains and secondarily chemical shrinkage is thus required to capture this geometric infidelity paving the way to better understanding the deformation phenomena.
期刊介绍:
Additive Manufacturing stands as a peer-reviewed journal dedicated to delivering high-quality research papers and reviews in the field of additive manufacturing, serving both academia and industry leaders. The journal's objective is to recognize the innovative essence of additive manufacturing and its diverse applications, providing a comprehensive overview of current developments and future prospects.
The transformative potential of additive manufacturing technologies in product design and manufacturing is poised to disrupt traditional approaches. In response to this paradigm shift, a distinctive and comprehensive publication outlet was essential. Additive Manufacturing fulfills this need, offering a platform for engineers, materials scientists, and practitioners across academia and various industries to document and share innovations in these evolving technologies.