Kinetically and Thermodynamically Controlled Cross-Linking in Sustainable Digital Light Processing Printing: Enabling Thermoset Reprocessing via Thermal Leveling Effect

IF 9.6 1区 化学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Yi Ting Chong, Suxi Wang, Sirawit Pruksawan, Zhuang Mao Png*, Qiang Zhu, Zibiao Li and FuKe Wang*, 
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引用次数: 0

Abstract

High-performance resins are essential for digital light processing (DLP) 3D printing, yet most are thermosetting and lack reprocessability. Recently developed covalent adaptive networks address this limitation, but their reliance on specialized monomers hinders scalability and practical application. Herein, we report a 3D-printable resin formulated with isobornyl acrylate, a 1,2-diol-based boronic ester cross-linker (<4%), and tetradecanol as a trans-borylesterification mediator. At room temperature, tetradecanol remains unreactive, preserving a rigid thermoset matrix while forming microelastic domains that dissipate impact energy, achieving an 8600% increase in toughness with 15% tetradecanol. During hot pressing, the thermal leveling effect kinetically drives dynamic bond exchange, converting the thermoset into a thermoplastic material. Upon cooling, the reaction becomes thermodynamically controlled again, reestablishing the thermoset polymer network and recovering its mechanical properties. This resin uniquely transitions to a thermoplastic state only during reprocessing, reverting to a durable thermoset upon cooling, enabling sustainable, high-performance DLP printing with end-of-life reusability.

Abstract Image

可持续数字光处理印刷中的动力学和热力学控制交联:通过热平整效应实现热固性再加工
高性能树脂对于数字光处理(DLP) 3D打印是必不可少的,但大多数是热固性的,缺乏可再加工性。最近开发的共价自适应网络解决了这一限制,但它们对专用单体的依赖阻碍了可扩展性和实际应用。在此,我们报告了一种3d打印树脂,该树脂由丙烯酸异硼酸酯、1,2-二醇基硼酯交联剂(4%)和十四醇作为反式硼酯酯化介质配制而成。在室温下,十四醇保持不反应性,保持刚性热固性基体,同时形成微弹性区域,耗散冲击能量,当十四醇含量为15%时,韧性增加8600%。在热压过程中,热流平效应动态地驱动动态键交换,将热固性材料转化为热塑性材料。冷却后,反应再次受到热力学控制,重新建立热固性聚合物网络并恢复其机械性能。该树脂仅在再加工过程中转变为热塑性状态,冷却后恢复为耐用的热固性,从而实现可持续的高性能DLP打印,并具有可重复使用性。
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来源期刊
ACS Materials Letters
ACS Materials Letters MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
14.60
自引率
3.50%
发文量
261
期刊介绍: ACS Materials Letters is a journal that publishes high-quality and urgent papers at the forefront of fundamental and applied research in the field of materials science. It aims to bridge the gap between materials and other disciplines such as chemistry, engineering, and biology. The journal encourages multidisciplinary and innovative research that addresses global challenges. Papers submitted to ACS Materials Letters should clearly demonstrate the need for rapid disclosure of key results. The journal is interested in various areas including the design, synthesis, characterization, and evaluation of emerging materials, understanding the relationships between structure, property, and performance, as well as developing materials for applications in energy, environment, biomedical, electronics, and catalysis. The journal has a 2-year impact factor of 11.4 and is dedicated to publishing transformative materials research with fast processing times. The editors and staff of ACS Materials Letters actively participate in major scientific conferences and engage closely with readers and authors. The journal also maintains an active presence on social media to provide authors with greater visibility.
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