Preparation of Ag/Hf(C, N) composite powders by electroless plating

IF 2.5 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Zengjin Li, Yu Dai, Wenhao Du, Meiyan Chen, Fanhao Zeng
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Abstract

In this study, electroless plating was used to successfully create ultra-fine Ag/Hf(C, N) composite powders. The Ag layers, which were consistently and completely deposited on the surface of Hf(C, N) particles with a diameter of 5–6 μm, had an average thickness of about 200 nm. A thorough investigation was conducted into how the electroless plating conditions affected the composite characteristics. It was discovered that the AgNO3 concentration and the plating temperature affected the thickness of Ag layer covering the Hf(C, N) particles. A notable rise in the plated layer weight was noted when the AgNO3 concentration was increased to 35 g/L. However, weight increase was somewhat reduced when the AgNO3 concentration was raised to 40 g/L. Silver particles were consistently deposited on the surface of Hf(C, N) at a plating solution temperature of 30 °C, creating a uniformly thick and well-encapsulated layer of silver. The Ag-coated Hf(C, N) composite powders gained 285 mg/g in weight when the ideal plating conditions were fulfilled, which include the pH of 11, plating solution temperature of 30 °C and AgNO3 concentration 35 g/L.

化学镀法制备Ag/Hf(C, N)复合粉体
本研究采用化学镀法制备了超细Ag/Hf(C, N)复合粉体。Ag层均匀完整地沉积在直径为5 ~ 6 μm的Hf(C, N)颗粒表面,平均厚度约为200 nm。深入研究了化学镀条件对复合材料性能的影响。结果表明,AgNO3浓度和镀温对Hf(C, N)颗粒表面的Ag层厚度有影响。当AgNO3浓度增加到35 g/L时,镀层重量显著增加。当AgNO3浓度增加到40 g/L时,增重有所减少。在30°C的镀液温度下,银颗粒均匀地沉积在Hf(C, N)表面,形成均匀厚且包覆良好的银层。在pH为11、镀液温度为30℃、AgNO3浓度为35 g/L的理想电镀条件下,镀银的Hf(C, N)复合粉体的重量增加了285 mg/g。
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来源期刊
Applied Physics A
Applied Physics A 工程技术-材料科学:综合
CiteScore
4.80
自引率
7.40%
发文量
964
审稿时长
38 days
期刊介绍: Applied Physics A publishes experimental and theoretical investigations in applied physics as regular articles, rapid communications, and invited papers. The distinguished 30-member Board of Editors reflects the interdisciplinary approach of the journal and ensures the highest quality of peer review.
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