{"title":"Heat transfer analysis for cooling discrete heat source in microchannel equipped with flexible baffles using Al2O3-Cu /water hybrid nanofluid","authors":"Chemseddine Maatki , Karim Kriaa","doi":"10.1016/j.csite.2025.106241","DOIUrl":null,"url":null,"abstract":"<div><div>Numerical simulations are conducted to study heat transfer and flow dynamics in a microchannel with three constant-temperature heat sources (Left, Middle, and Right) and flexible baffles. The left and right heat sources are placed above baffles that align with fluid flow. Hybrid Al<sub>2</sub>O<sub>3</sub>-Cu nanoparticles are employed to improve thermal performance, with the effects of Reynolds number (Re), nanoparticle concentration (ϕ), Young's modulus (E), and baffle orientation systematically analyzed. The Middle heat source demonstrates superior thermal efficiency, achieving a peak heat transfer coefficient of 51.285 kW/m<sup>2</sup>·K at ϕ = 5 %, Re = 60, and E = 200 kPa. The difference in heat transfer efficiency between the left and right sources is induced by the effect of the orientation of the baffles relative to the fluid flow in the channel. Higher Reynolds numbers improve convection, leading in a 34.8 % improvement in the Middle Source over lower Re values. The increasing of nanoparticle concentration from 0 % to 5 % improves the efficiency of heat transfer by 10 % for the left source. Intermediate baffle flexibility improves disturbance generation and maintain a stable structure and flow mixing. These results offer important prospects for the development of microchannel systems for innovative cooling applications in electronics.</div></div>","PeriodicalId":9658,"journal":{"name":"Case Studies in Thermal Engineering","volume":"71 ","pages":"Article 106241"},"PeriodicalIF":6.4000,"publicationDate":"2025-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Case Studies in Thermal Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2214157X25005015","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"THERMODYNAMICS","Score":null,"Total":0}
引用次数: 0
Abstract
Numerical simulations are conducted to study heat transfer and flow dynamics in a microchannel with three constant-temperature heat sources (Left, Middle, and Right) and flexible baffles. The left and right heat sources are placed above baffles that align with fluid flow. Hybrid Al2O3-Cu nanoparticles are employed to improve thermal performance, with the effects of Reynolds number (Re), nanoparticle concentration (ϕ), Young's modulus (E), and baffle orientation systematically analyzed. The Middle heat source demonstrates superior thermal efficiency, achieving a peak heat transfer coefficient of 51.285 kW/m2·K at ϕ = 5 %, Re = 60, and E = 200 kPa. The difference in heat transfer efficiency between the left and right sources is induced by the effect of the orientation of the baffles relative to the fluid flow in the channel. Higher Reynolds numbers improve convection, leading in a 34.8 % improvement in the Middle Source over lower Re values. The increasing of nanoparticle concentration from 0 % to 5 % improves the efficiency of heat transfer by 10 % for the left source. Intermediate baffle flexibility improves disturbance generation and maintain a stable structure and flow mixing. These results offer important prospects for the development of microchannel systems for innovative cooling applications in electronics.
期刊介绍:
Case Studies in Thermal Engineering provides a forum for the rapid publication of short, structured Case Studies in Thermal Engineering and related Short Communications. It provides an essential compendium of case studies for researchers and practitioners in the field of thermal engineering and others who are interested in aspects of thermal engineering cases that could affect other engineering processes. The journal not only publishes new and novel case studies, but also provides a forum for the publication of high quality descriptions of classic thermal engineering problems. The scope of the journal includes case studies of thermal engineering problems in components, devices and systems using existing experimental and numerical techniques in the areas of mechanical, aerospace, chemical, medical, thermal management for electronics, heat exchangers, regeneration, solar thermal energy, thermal storage, building energy conservation, and power generation. Case studies of thermal problems in other areas will also be considered.