TCAD simulations of radiation damage in 4H-SiC

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jürgen Burin, Christopher Hahn, Philipp Gaggl, Andreas Gsponer, Simon Waid, Thomas Bergauer
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引用次数: 0

Abstract

In this paper we present simulation based radiation damage modeling of 4H silicon carbide (SiC) using the technology computer aided design (TCAD) tools for up to 1 kV forward and backward bias. After verifying the TCAD framework from Global TCAD Solutions (GTS) against Sentaurus simulations for silicon we use it to approximate measurements of neutron-irradiated 4H-SiC particle detectors, i.e., pin-diodes. Based on our simulations we are not only able to evaluate the accuracy of the predictions but also to provide an explanation for the almost negligible current of radiated devices under high forward bias.
4H-SiC辐射损伤的TCAD模拟
本文采用计算机辅助设计(TCAD)工具对4H碳化硅(SiC)的正向和反向偏压进行了基于仿真的辐射损伤建模。在验证了来自Global TCAD Solutions (GTS)的TCAD框架与Sentaurus对硅的模拟之后,我们使用它来近似测量中子辐照的4H-SiC粒子探测器,即pin-二极管。基于我们的模拟,我们不仅能够评估预测的准确性,而且还提供了在高正向偏置下辐射器件几乎可以忽略的电流的解释。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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