Microstructure, Mechanical Properties and Thermal Conductivity of Al-RE-xSi Alloys

IF 2.1 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Electronic Materials Letters Pub Date : 2025-04-05 DOI:10.1007/s13391-025-00551-1

Hyeon-Taek Son, Yong-Ho Kim, Hyo-Sang Yoo, Byong-Kwon Lee, Eun-Chan Ko, Seong-Ho Lee, Gyu-Seok Lee

{"title":"Microstructure, Mechanical Properties and Thermal Conductivity of Al-RE-xSi Alloys","authors":"Hyeon-Taek Son, Yong-Ho Kim, Hyo-Sang Yoo, Byong-Kwon Lee, Eun-Chan Ko, Seong-Ho Lee, Gyu-Seok Lee","doi":"10.1007/s13391-025-00551-1","DOIUrl":null,"url":null,"abstract":"<div><p>This study investigates the effects of Si content on the microstructure, mechanical properties and thermal conductivity of Al-1MM (Misch Metal) alloys. The phase transformation during solidification was analyzed using Pandat software, and the microstructure was examined through SEM and EDS. Fluidity tests were conducted to evaluate castability, while electrical and thermal conductivity were measured for both as-cast and extruded conditions. The results show that increasing Si content in Al-1MM alloys leads to the formation of finer intermetallic compounds and eutectic structures compared to commercial ADC12 alloy. The addition of MM improves electrical and thermal conductivity by forming intermetallic compounds with Si. While tensile strength increases with Si content, elongation decreases. Al-1MM-xSi alloys exhibit significantly higher ductility compared to ADC12 alloy.</p><h3>Graphical Abstract</h3><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":536,"journal":{"name":"Electronic Materials Letters","volume":"21 3","pages":"456 - 463"},"PeriodicalIF":2.1000,"publicationDate":"2025-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronic Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s13391-025-00551-1","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

Abstract

This study investigates the effects of Si content on the microstructure, mechanical properties and thermal conductivity of Al-1MM (Misch Metal) alloys. The phase transformation during solidification was analyzed using Pandat software, and the microstructure was examined through SEM and EDS. Fluidity tests were conducted to evaluate castability, while electrical and thermal conductivity were measured for both as-cast and extruded conditions. The results show that increasing Si content in Al-1MM alloys leads to the formation of finer intermetallic compounds and eutectic structures compared to commercial ADC12 alloy. The addition of MM improves electrical and thermal conductivity by forming intermetallic compounds with Si. While tensile strength increases with Si content, elongation decreases. Al-1MM-xSi alloys exhibit significantly higher ductility compared to ADC12 alloy.

Graphical Abstract

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Al-RE-xSi合金的显微组织、力学性能和导热性能

研究了Si含量对Al-1MM （Misch Metal）合金显微组织、力学性能和导热性能的影响。利用Pandat软件分析了凝固过程中的相变，并通过扫描电镜和能谱仪对其微观组织进行了分析。通过流动性测试来评估浇注性，同时在铸态和挤压状态下测量电导率和导热性。结果表明：与ADC12合金相比，Al-1MM合金中Si含量的增加可以形成更细的金属间化合物和共晶结构；MM的加入通过与Si形成金属间化合物提高了导电和导热性。拉伸强度随Si含量的增加而增加，伸长率随Si含量的增加而降低。Al-1MM-xSi合金的延展性明显高于ADC12合金。图形抽象

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来源期刊

Electronic Materials Letters 工程技术-材料科学：综合

CiteScore

4.70

自引率

20.80%

发文量

审稿时长

2.3 months

期刊介绍： Electronic Materials Letters is an official journal of the Korean Institute of Metals and Materials. It is a peer-reviewed international journal publishing print and online version. It covers all disciplines of research and technology in electronic materials. Emphasis is placed on science, engineering and applications of advanced materials, including electronic, magnetic, optical, organic, electrochemical, mechanical, and nanoscale materials. The aspects of synthesis and processing include thin films, nanostructures, self assembly, and bulk, all related to thermodynamics, kinetics and/or modeling.