In-situ Stress Analysis of Nickel Nanoparticle Sintering with Metal Additive in Multi-Layer Ceramic Capacitors

IF 2.1 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Electronic Materials Letters Pub Date : 2025-03-08 DOI:10.1007/s13391-025-00556-w

Youngran Jung, Wonhyo Joo, Kyung Rul Lee, Cheol Kim, Min-Jung Choi, Young-Chang Joo, So-Yeon Lee

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Abstract

In the pursuit of increasing the sintering temperature of multi-layer ceramic capacitors (MLCCs) of the metal electrode layer, this study examines the effect of secondary metal additives on the sintering behavior of nickel (Ni) nanoparticles. Traditionally, the discrepancy in sintering temperatures between metal and dielectric particles poses a challenge in MLCC fabrication, often resulting in uneven layer formation and device shortage. We introduced 0.1 atomic percent of tin (Sn), antimony (Sb), and cobalt (Co) into Ni nanoparticles and investigated their influence on sintering temperatures in the metal layer. Utilizing in-situ stress analysis and field emission scanning electron microscope (FE-SEM) imaging, we found that Sn and Sb effectively hindered the onset of neck formation and coalescence by forming intermetallic phases, whereas Co showed no such effect. These findings suggest that the strategic addition of specific secondary metals can shift the sintering behavior initiation of Ni related to the structural integrity during the MLCC fabrication and the performance of MLCCs. The research highlights the potential of using secondary metal additives to refine the thermal processing steps in electronic component manufacturing, aiming for more reliable and efficient devices.

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金属添加剂在多层陶瓷电容器中烧结纳米镍的原位应力分析

为了提高金属电极层多层陶瓷电容器（mlcc）的烧结温度，本研究考察了二次金属添加剂对镍纳米颗粒烧结行为的影响。传统上，金属和介电颗粒之间的烧结温度差异给MLCC制造带来了挑战，经常导致层形成不均匀和器件短缺。我们在Ni纳米颗粒中加入0.1%的锡（Sn）、锑（Sb）和钴（Co），并研究了它们对金属层烧结温度的影响。通过地应力分析和场发射扫描电镜（FE-SEM）成像，我们发现Sn和Sb通过形成金属间相有效地阻碍了颈部形成和聚结的发生，而Co则没有这种作用。研究结果表明，选择性添加特定的二次金属可以改变与MLCC制备过程中结构完整性和MLCC性能相关的Ni的烧结行为。该研究强调了使用二次金属添加剂来改进电子元件制造中的热加工步骤的潜力，旨在制造更可靠和高效的设备。

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来源期刊

Electronic Materials Letters 工程技术-材料科学：综合

CiteScore

4.70

自引率

20.80%

发文量

审稿时长

2.3 months

期刊介绍： Electronic Materials Letters is an official journal of the Korean Institute of Metals and Materials. It is a peer-reviewed international journal publishing print and online version. It covers all disciplines of research and technology in electronic materials. Emphasis is placed on science, engineering and applications of advanced materials, including electronic, magnetic, optical, organic, electrochemical, mechanical, and nanoscale materials. The aspects of synthesis and processing include thin films, nanostructures, self assembly, and bulk, all related to thermodynamics, kinetics and/or modeling.