{"title":"A Novel Hybrid Photonic Integration Scheme Based on Flip-Chip Bonding Combined With Vertical Coupling","authors":"Guojiong Li;Xiangyang Dai;Yuanhao Zhang;Liyuan Song;Panpan Yu;Minwen Xiang;Can Liu;Juan Xia;Qiaoyin Lu;Weihua Guo","doi":"10.1109/JPHOT.2025.3560668","DOIUrl":null,"url":null,"abstract":"A hybrid photonic integration scheme based on flip-chip bonding combined with vertical coupling is presented in this work, offering a novel solution for the integration of active and passive chips. An offset quantum-well laser is flipped and bonded into the pre-set cavity of the passive chip. The light emitted from the laser propagates through a taper into the passive chip. The proposed scheme utilizes only the existing processes, eliminating the need for additional process development. Furthermore, it preserves the performance of the laser while providing high tolerance. Simulations indicate that the coupling tolerance for 90% coupling efficiency is approximately ±1.5 μm in the lateral direction with the longitudinal tolerance exceeding 20 μm. The coupling efficiency remains stable across the O-band. This scheme is adaptable for integrating various photonic chips such as tunable lasers, high-speed modulators and detectors, and laser radar systems.","PeriodicalId":13204,"journal":{"name":"IEEE Photonics Journal","volume":"17 3","pages":"1-7"},"PeriodicalIF":2.1000,"publicationDate":"2025-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10964542","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Photonics Journal","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10964542/","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
A hybrid photonic integration scheme based on flip-chip bonding combined with vertical coupling is presented in this work, offering a novel solution for the integration of active and passive chips. An offset quantum-well laser is flipped and bonded into the pre-set cavity of the passive chip. The light emitted from the laser propagates through a taper into the passive chip. The proposed scheme utilizes only the existing processes, eliminating the need for additional process development. Furthermore, it preserves the performance of the laser while providing high tolerance. Simulations indicate that the coupling tolerance for 90% coupling efficiency is approximately ±1.5 μm in the lateral direction with the longitudinal tolerance exceeding 20 μm. The coupling efficiency remains stable across the O-band. This scheme is adaptable for integrating various photonic chips such as tunable lasers, high-speed modulators and detectors, and laser radar systems.
期刊介绍:
Breakthroughs in the generation of light and in its control and utilization have given rise to the field of Photonics, a rapidly expanding area of science and technology with major technological and economic impact. Photonics integrates quantum electronics and optics to accelerate progress in the generation of novel photon sources and in their utilization in emerging applications at the micro and nano scales spanning from the far-infrared/THz to the x-ray region of the electromagnetic spectrum. IEEE Photonics Journal is an online-only journal dedicated to the rapid disclosure of top-quality peer-reviewed research at the forefront of all areas of photonics. Contributions addressing issues ranging from fundamental understanding to emerging technologies and applications are within the scope of the Journal. The Journal includes topics in: Photon sources from far infrared to X-rays, Photonics materials and engineered photonic structures, Integrated optics and optoelectronic, Ultrafast, attosecond, high field and short wavelength photonics, Biophotonics, including DNA photonics, Nanophotonics, Magnetophotonics, Fundamentals of light propagation and interaction; nonlinear effects, Optical data storage, Fiber optics and optical communications devices, systems, and technologies, Micro Opto Electro Mechanical Systems (MOEMS), Microwave photonics, Optical Sensors.