{"title":"Mechanical and fracture behaviour of epoxy polymer under extreme low temperature and high strain rate conditions","authors":"Palak Bhagoria, Muddu Rahul Bharadwaj, Rohit Kumar, Kuldeep Yadav, Vikrant Tiwari","doi":"10.1016/j.ijadhadh.2025.104039","DOIUrl":null,"url":null,"abstract":"<div><div>Low-temperature studies are crucial in material science, cryogenic, and aerospace engineering, where materials endure extreme temperatures. High strain rate loading at low temperatures significantly affects material performance and integrity. This article investigates the dynamic mechanical response of EPOFINE®-1564, a Bisphenol-A-based liquid epoxy resin, using Split Hopkinson Pressure Bar (SHPB) and Modified Hopkinson Pressure Bar (MHPB) at high strain rates. An in-house built liquid nitrogen environment chamber was used to attain low temperatures. Dynamic experiments under compressive loading were conducted at strain rates of 710–2051 s<sup>−1</sup> and temperatures between −120 °C and −25 °C, while under tensile loading, the experiments were performed at strain rates of 1125–2194 s<sup>−1</sup> and temperatures between −70 °C and −40 °C. The results revealed an increase of strength and stiffness by 12.3 % and 16.66 %, respectively, for compressive loading with a decrease in temperature from −25 °C to −120 °C. Similarly, these properties increased by 9.28 % and 2.6 % for tensile loading with the decrease in temperature from −40 °C to −70 °C. Additionally, MHPB was employed to investigate the fracture behaviour of the epoxy resin under dynamic loading (6 m/s – 12 m/s) using Three-Point Bend (TPB) specimens. High-speed imaging and 3D Digital Image Correlation (DIC) revealed that dynamic fracture toughness decreased with temperature, weakening intermolecular interactions, and reducing crack resistance. Analyzing the fracture surface using scanning electron microscopy revealed the disappearance of stretch zones and crazes as brittleness increased with decreasing temperature.</div></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":"140 ","pages":"Article 104039"},"PeriodicalIF":3.5000,"publicationDate":"2025-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Adhesion and Adhesives","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S014374962500106X","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Low-temperature studies are crucial in material science, cryogenic, and aerospace engineering, where materials endure extreme temperatures. High strain rate loading at low temperatures significantly affects material performance and integrity. This article investigates the dynamic mechanical response of EPOFINE®-1564, a Bisphenol-A-based liquid epoxy resin, using Split Hopkinson Pressure Bar (SHPB) and Modified Hopkinson Pressure Bar (MHPB) at high strain rates. An in-house built liquid nitrogen environment chamber was used to attain low temperatures. Dynamic experiments under compressive loading were conducted at strain rates of 710–2051 s−1 and temperatures between −120 °C and −25 °C, while under tensile loading, the experiments were performed at strain rates of 1125–2194 s−1 and temperatures between −70 °C and −40 °C. The results revealed an increase of strength and stiffness by 12.3 % and 16.66 %, respectively, for compressive loading with a decrease in temperature from −25 °C to −120 °C. Similarly, these properties increased by 9.28 % and 2.6 % for tensile loading with the decrease in temperature from −40 °C to −70 °C. Additionally, MHPB was employed to investigate the fracture behaviour of the epoxy resin under dynamic loading (6 m/s – 12 m/s) using Three-Point Bend (TPB) specimens. High-speed imaging and 3D Digital Image Correlation (DIC) revealed that dynamic fracture toughness decreased with temperature, weakening intermolecular interactions, and reducing crack resistance. Analyzing the fracture surface using scanning electron microscopy revealed the disappearance of stretch zones and crazes as brittleness increased with decreasing temperature.
期刊介绍:
The International Journal of Adhesion and Adhesives draws together the many aspects of the science and technology of adhesive materials, from fundamental research and development work to industrial applications. Subject areas covered include: interfacial interactions, surface chemistry, methods of testing, accumulation of test data on physical and mechanical properties, environmental effects, new adhesive materials, sealants, design of bonded joints, and manufacturing technology.