3D Structural damage visualisation in fiber composites via a smart 3D capacitive printed sensor network

IF 4.1 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Georgios Foteinidis, Lampros Koutsotolis, Angelos Ntaflos, Alkiviadis S. Paipetis
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Abstract

The ever-increasing use of composite materials in high-end structural applications calls for reliable damage diagnostics. This study proposes an innovative approach to convert a conventional glass fibre laminate into a multifunctional self-monitoring material without the need for external sensing systems. To this end, a single-walled carbon nanotube (SWCNT)-based ink is employed to establish parallel conductive paths onto glass fibre substrates via a versatile spray-coating method. The glass fibre fabrics are laid up in an alternating perpendicular direction to form a functional grid within the laminate, therefore imparting sensing capabilities. To ensure enhanced electrical performance a ternary nanomodified epoxy resin, comprising multi-walled carbon nanotube (MWCNTs) and carbon black (CB) as additives, is used. Laminates are subjected to ballistic impact, while impedance spectroscopy is utilised to detect the induced damage. The herein suggested configuration allows for localised monitoring at the intersection points of the sensing grid, thereby facilitating damage within the matrix and imparting self-sensing capabilities to the composite. Through the systematic processing of complex impedance data and the subsequent visualisation of the signal, a topographical representation of the affected area is produced. To validate the proposed damage detection methodology and strengthen the findings X-ray microcomputed tomography and infrared thermography are also employed. The successful implementation of damage mapping by exploiting a purposely designed multifunctional composite with inherent sensing capabilities demonstrates its potential as a reliable and effective Structural Health Monitoring (SHM) technique.
基于智能3D电容打印传感器网络的纤维复合材料结构损伤可视化
复合材料在高端结构应用中越来越多的使用要求可靠的损伤诊断。本研究提出了一种创新的方法,将传统的玻璃纤维层压板转化为多功能自监测材料,而无需外部传感系统。为此,采用单壁碳纳米管(SWCNT)基油墨,通过多功能喷涂方法在玻璃纤维基板上建立平行导电路径。玻璃纤维织物以交替垂直方向堆叠,在层压板内形成功能网格,从而赋予传感能力。为了确保增强的电性能,使用三元纳米改性环氧树脂,包括多壁碳纳米管(MWCNTs)和炭黑(CB)作为添加剂。层压板受到弹道冲击,而阻抗光谱被用来检测诱发损伤。本文建议的配置允许在传感网格的交叉点进行局部监测,从而促进矩阵内的损坏并赋予复合材料自传感能力。通过系统地处理复杂的阻抗数据和随后的信号可视化,产生了受影响区域的地形表示。为了验证所提出的损伤检测方法并加强研究结果,还采用了x射线微计算机断层扫描和红外热成像。利用具有固有传感能力的专门设计的多功能复合材料,成功地实现了损伤映射,这表明了它作为一种可靠有效的结构健康监测(SHM)技术的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Sensors and Actuators A-physical
Sensors and Actuators A-physical 工程技术-工程:电子与电气
CiteScore
8.10
自引率
6.50%
发文量
630
审稿时长
49 days
期刊介绍: Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas: • Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results. • Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon. • Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays. • Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers. Etc...
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