High reliable and ultra-flexible transparent heaters composed of ZnO-Ag core–shell nanowires and PVDF films

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2025-04-27 DOI:10.1007/s10854-025-14815-x

Haoran Zheng, Shihui Yu, Jinke Bai

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引用次数: 0

Abstract

A scalable strategy is proposed for preparing ultra-flexible transparent heaters (THs) with ZnO-Ag core–shell nanowires (ZnO@Ag NWs) embedded in polyvinylidene fluoride composite films. The obtained THs exhibit a high average transmittance of 85.8% in the visible spectral range and excellent heating performance. The maximum saturation temperature can reach 153 °C within 10 s at an input voltage of 4.0 V. Furthermore, the saturation temperature of THs has not changed significantly after 1000 bending cycles with a curvature radius of 0.5 mm, demonstrating excellent mechanical flexibility. In particular, the THs possess environmental endurance, and no significant deterioration in performance can be found after exposure to high humidity (relative humidity: 85%) and ultraviolet ozone (254 and 185 nm) irradiation for 10 h, which is attributed to the protective role provided by the covering of ZnO shells on the Ag NWs. These outstanding parameters make the fabricated THs to be promising for application in wearable systems, medical thermotherapy pads and industrial defrosters.

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由ZnO-Ag核壳纳米线和PVDF薄膜组成的高可靠性和超柔性透明加热器

提出了一种将ZnO-Ag核壳纳米线（ZnO@Ag NWs）嵌入聚偏氟乙烯复合薄膜中制备超柔性透明加热器（THs）的可扩展策略。该材料在可见光范围内平均透过率高达85.8%，具有良好的加热性能。在4.0 V输入电压下，10s内最高饱和温度可达153℃。此外，在曲率半径为0.5 mm的1000次弯曲循环后，THs的饱和温度没有明显变化，表现出良好的机械柔性。特别是，在高湿度（相对湿度85%）和紫外臭氧（254和185 nm）照射10 h后，其性能没有明显下降，这是由于ZnO外壳覆盖在Ag NWs上提供了保护作用。这些突出的参数使得制造的三极管在可穿戴系统、医疗热疗垫和工业除霜器中有很大的应用前景。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.