Jungkyu Park, Fahim Dorsey, Aayush Patel, Donghwa Jeong
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引用次数: 0
Abstract
This study examines the effects of shear induced wrinkles on the thermal transport properties of hexagonal boron nitride (hBN) ribbons. Reverse nonequilibrium molecular dynamics simulations were performed using a Tersoff force field to estimate the thermal conductivity of both undeformed and shear-wrinkled hBN nanoribbons of various widths and lengths. The results indicate that the impact of shear induced wrinkling on thermal conductivity is more evident in narrower ribbons, where lattice distortion and bond stretching are more severe. In contrast, wider ribbons exhibit relatively milder distortions and thus less reduction in heat dissipation capability. Notably, the bulk thermal conductivity of the narrowest hBN ribbon simulated in the present study decreased by 47 % at a shear strain of 0.3 compared to its undeformed structure, whereas the widest ribbon simulated in the present research study showed only a 25 % reduction. Phonon density of states analyses revealed substantial alterations in low-frequency acoustic phonons under shear-wrinkling, with flexural acoustic modes identified as the primary contributors to thermal performance degradation. The findings of this study are expected to inform the design of new materials with improved heat dissipation capabilities for flexible electronics.
期刊介绍:
Case Studies in Thermal Engineering provides a forum for the rapid publication of short, structured Case Studies in Thermal Engineering and related Short Communications. It provides an essential compendium of case studies for researchers and practitioners in the field of thermal engineering and others who are interested in aspects of thermal engineering cases that could affect other engineering processes. The journal not only publishes new and novel case studies, but also provides a forum for the publication of high quality descriptions of classic thermal engineering problems. The scope of the journal includes case studies of thermal engineering problems in components, devices and systems using existing experimental and numerical techniques in the areas of mechanical, aerospace, chemical, medical, thermal management for electronics, heat exchangers, regeneration, solar thermal energy, thermal storage, building energy conservation, and power generation. Case studies of thermal problems in other areas will also be considered.