A Flying-Capacitor-Assisted Single-Mode Buck-Boost Converter for Battery-Powered Applications

IF 2.8 2区工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2025-03-13 DOI:10.1109/TVLSI.2025.3535698

Sunghae Kim;Taehee Lee;Kunhee Cho;Jaeduk Han

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引用次数: 0

Abstract

A single-mode buck-boost converter that generates a 3.3-V power supply from a variable input voltage (

${V} _{\mathbf {IN}}$

) range of 2.7–4.2 V for mobile li-ion battery applications is presented. The proposed buck-boost converter employs a switched-capacitor-based buck-converter operation, in which the voltage switching operation is followed by an LC filter. This ensures continuous output current delivery and reduces conduction loss in the inductor. An efficient power-stage structure and its operation are introduced, wherein only one resistive component is connected in series with the inductor during all operation phases. The proposed buck-boost converter has been implemented in a 180-nm BCDMOS process and regulates an output voltage of 3.3 V from a

${V} _{\mathbf {IN}}$

range of 2.7–4.2 V by single-mode step-up/down operation. The peak efficiency of 93.4% is achieved at 2.7-V

${V} _{\mathbf {IN}}$

, and the peak efficiency above 90% is obtained over the entire

${V} _{\mathbf {IN}}$

range.

查看原文本刊更多论文

一种用于电池供电的飞行电容辅助单模降压-升压转换器

提出了一种单模降压-升压变换器，该变换器从2.7-4.2 V的可变输入电压（${V} _{\mathbf {IN}}$）中产生3.3 V的电源，用于移动锂离子电池应用。提出的降压-升压变换器采用基于开关电容的降压变换器操作，其中电压开关操作之后是LC滤波器。这确保了连续输出电流的传递，并减少了电感的传导损耗。介绍了一种高效的功率级结构及其工作原理，其中在所有工作相中只有一个电阻元件与电感串联。所提出的降压变换器已在180 nm的BCDMOS工艺中实现，并通过单模升压/降压操作从${V} _{\mathbf {in}}$ 2.7-4.2 V的范围内调节3.3 V的输出电压。在2.7 V ${V} _{\mathbf {IN}}$时达到93.4%的峰值效率，在整个${V} _{\mathbf {IN}}$范围内达到90%以上的峰值效率。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Very Large Scale Integration (VLSI) Systems 工程技术-工程：电子与电气

CiteScore

6.40

自引率

7.10%

发文量

187

审稿时长

3.6 months

期刊介绍： The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.