{"title":"An Efficient Test Architecture Using Hybrid Built-In Self-Test for Processing-in-Memory","authors":"Hayoung Lee;Juyong Lee;Sungho Kang","doi":"10.1109/TVLSI.2024.3504539","DOIUrl":null,"url":null,"abstract":"With the rapid advances in artificial intelligence (AI), the demand for data-intensive analytics has surged. Consequently, extensive research on AI acceleration has been conducted to enhance AI performance. Processing-in-memory (PiM) has emerged as a promising AI acceleration architecture, offering an unprecedented high-bandwidth connection between compute and memory. However, integrating many components in PiM can lead to yield degradation. To address this issue, we propose an efficient test architecture that utilizes a hybrid built-in self-test (BIST) for PiM. This architecture utilizes the structural and operational characteristics of PiM to facilitate testing. It can execute testing through the existing functional paths without requiring any additional hardware implementation in PiM. Furthermore, it achieves a 100% test coverage with the small number of test patterns. In addition, the functionality of self-test can be realized for PiM through reconfiguration of the existing hardware, resulting in a very small area overhead.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"33 5","pages":"1452-1456"},"PeriodicalIF":2.8000,"publicationDate":"2024-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10777846/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
With the rapid advances in artificial intelligence (AI), the demand for data-intensive analytics has surged. Consequently, extensive research on AI acceleration has been conducted to enhance AI performance. Processing-in-memory (PiM) has emerged as a promising AI acceleration architecture, offering an unprecedented high-bandwidth connection between compute and memory. However, integrating many components in PiM can lead to yield degradation. To address this issue, we propose an efficient test architecture that utilizes a hybrid built-in self-test (BIST) for PiM. This architecture utilizes the structural and operational characteristics of PiM to facilitate testing. It can execute testing through the existing functional paths without requiring any additional hardware implementation in PiM. Furthermore, it achieves a 100% test coverage with the small number of test patterns. In addition, the functionality of self-test can be realized for PiM through reconfiguration of the existing hardware, resulting in a very small area overhead.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.