Xiaowan Kang, Xiaojian Chen, Jialin Yang, Junliang Zhao, Chang Yang
{"title":"Transparent and flexible electromagnetic interference shielding thin film based on sulfurized copper iodide","authors":"Xiaowan Kang, Xiaojian Chen, Jialin Yang, Junliang Zhao, Chang Yang","doi":"10.1063/5.0267198","DOIUrl":null,"url":null,"abstract":"A transparent and flexible electromagnetic interference (EMI) shielding thin film is fabricated through a two-step process involving magnetron sputtering of copper iodide (CuI), followed by sulfurization. This Cu–I–S compound effectively combines the high optical transparency of the CuI matrix with the enhanced electrical conductivity imparted by sulfur incorporation. The optical and electrical properties of the Cu–I–S thin film can be systematically tuned by modulating the I/S ratio. Notably, the films exhibit exceptional mechanical stability, with less than 5% variation in conductivity after 5000 bending cycles at a curvature radius of 8 mm. These thin films achieve an optimal electromagnetic shielding effectiveness of ∼30 dB at the X-band (8–12 GHz). These findings reveal the great potential of CuI-based materials in various optoelectronic and flexible device applications.","PeriodicalId":8094,"journal":{"name":"Applied Physics Letters","volume":"24 1","pages":""},"PeriodicalIF":3.5000,"publicationDate":"2025-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Physics Letters","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.1063/5.0267198","RegionNum":2,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"PHYSICS, APPLIED","Score":null,"Total":0}
引用次数: 0
Abstract
A transparent and flexible electromagnetic interference (EMI) shielding thin film is fabricated through a two-step process involving magnetron sputtering of copper iodide (CuI), followed by sulfurization. This Cu–I–S compound effectively combines the high optical transparency of the CuI matrix with the enhanced electrical conductivity imparted by sulfur incorporation. The optical and electrical properties of the Cu–I–S thin film can be systematically tuned by modulating the I/S ratio. Notably, the films exhibit exceptional mechanical stability, with less than 5% variation in conductivity after 5000 bending cycles at a curvature radius of 8 mm. These thin films achieve an optimal electromagnetic shielding effectiveness of ∼30 dB at the X-band (8–12 GHz). These findings reveal the great potential of CuI-based materials in various optoelectronic and flexible device applications.
期刊介绍:
Applied Physics Letters (APL) features concise, up-to-date reports on significant new findings in applied physics. Emphasizing rapid dissemination of key data and new physical insights, APL offers prompt publication of new experimental and theoretical papers reporting applications of physics phenomena to all branches of science, engineering, and modern technology.
In addition to regular articles, the journal also publishes invited Fast Track, Perspectives, and in-depth Editorials which report on cutting-edge areas in applied physics.
APL Perspectives are forward-looking invited letters which highlight recent developments or discoveries. Emphasis is placed on very recent developments, potentially disruptive technologies, open questions and possible solutions. They also include a mini-roadmap detailing where the community should direct efforts in order for the phenomena to be viable for application and the challenges associated with meeting that performance threshold. Perspectives are characterized by personal viewpoints and opinions of recognized experts in the field.
Fast Track articles are invited original research articles that report results that are particularly novel and important or provide a significant advancement in an emerging field. Because of the urgency and scientific importance of the work, the peer review process is accelerated. If, during the review process, it becomes apparent that the paper does not meet the Fast Track criterion, it is returned to a normal track.