{"title":"Top Cooling and Heat Transfer Dynamics in the Growth of Large Silicon Crystals Using the CZ Method","authors":"Yi-Jen Huang, Amir Reza Ansari Dezfoli","doi":"10.1007/s12633-025-03250-6","DOIUrl":null,"url":null,"abstract":"<div><p>The increasing global demand for semiconductors, driven by advancements in technologies such as 5G, artificial intelligence, electric vehicles, and consumer electronics, has underscored the need to produce larger Czochralski (CZ) silicon wafers. Larger wafers enable higher chip yields per wafer, improving manufacturing efficiency and reducing costs. This study proposes a novel \"top cooling\" system to further increase the growth speed of large-diameter silicon wafers while maintaining high crystal quality. Using advanced simulation modeling, the study demonstrates the significant impact of top cooling on reducing temperature and crystal-front deflection, particularly for larger wafers. The findings highlight the potential of this cooling method to address silicon shortages by improving production efficiency without sacrificing material quality.</p></div>","PeriodicalId":776,"journal":{"name":"Silicon","volume":"17 5","pages":"1009 - 1017"},"PeriodicalIF":2.8000,"publicationDate":"2025-02-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Silicon","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s12633-025-03250-6","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
The increasing global demand for semiconductors, driven by advancements in technologies such as 5G, artificial intelligence, electric vehicles, and consumer electronics, has underscored the need to produce larger Czochralski (CZ) silicon wafers. Larger wafers enable higher chip yields per wafer, improving manufacturing efficiency and reducing costs. This study proposes a novel "top cooling" system to further increase the growth speed of large-diameter silicon wafers while maintaining high crystal quality. Using advanced simulation modeling, the study demonstrates the significant impact of top cooling on reducing temperature and crystal-front deflection, particularly for larger wafers. The findings highlight the potential of this cooling method to address silicon shortages by improving production efficiency without sacrificing material quality.
期刊介绍：
The journal Silicon is intended to serve all those involved in studying the role of silicon as an enabling element in materials science. There are no restrictions on disciplinary boundaries provided the focus is on silicon-based materials or adds significantly to the understanding of such materials. Accordingly, such contributions are welcome in the areas of inorganic and organic chemistry, physics, biology, engineering, nanoscience, environmental science, electronics and optoelectronics, and modeling and theory. Relevant silicon-based materials include, but are not limited to, semiconductors, polymers, composites, ceramics, glasses, coatings, resins, composites, small molecules, and thin films.
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