An RF Amplifier Integrated With a Monitoring Sensor and a Terminal Power Sensor

IF 2.2 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Jiarui Hao;Xiaoping Liao;Zaifa Zhou
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引用次数: 0

Abstract

This work proposes a radio frequency (RF) amplifier that integrates a monitoring sensor and a terminal power sensor. It is fabricated in a 0.18-µm RF complementary metal oxide semiconductor (CMOS) technology. The monitoring sensor placed 2.25 µm away from the mosfet detects the dissipated heat of the RF amplifier and monitors its operational status. The terminal power sensor serves as the load that enables in-line output power measurement. The monitoring sensor and terminal power sensor comprise 22 and 24 sets of thermocouples, respectively, which are made of aluminum and p-type polysilicon. The RF amplifier exhibits a minimum input return loss of −9.11 dB at 3.04 GHz. The peak gain at 3.5 GHz is 9.38 dB, which is determined from the analysis of the output voltage of the terminal power sensor. The output voltage of the monitoring sensor changes from 0.986 to 0.957 mV as the input power varies from −12 to 0 dBm. In relation to conventional state detection methods, this approach eliminates the need for external test equipment.
一种集成监控传感器和终端功率传感器的射频放大器
本工作提出一种集成了监测传感器和终端功率传感器的射频放大器。它采用0.18 μ m RF互补金属氧化物半导体(CMOS)技术制造。监控传感器放置在距离mosfet 2.25µm的位置,用于检测射频放大器的散热并监控其运行状态。终端功率传感器作为负载,实现在线输出功率测量。监测传感器和终端功率传感器分别由22组和24组热电偶组成,热电偶由铝和p型多晶硅制成。该射频放大器在3.04 GHz时的最小输入回波损耗为- 9.11 dB。3.5 GHz时的峰值增益为9.38 dB,由对终端功率传感器输出电压的分析确定。当输入功率为- 12 ~ 0 dBm时,监控传感器输出电压在0.986 ~ 0.957 mV范围内变化。与传统的状态检测方法相比,这种方法不需要外部测试设备。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Sensors Letters
IEEE Sensors Letters Engineering-Electrical and Electronic Engineering
CiteScore
3.50
自引率
7.10%
发文量
194
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