Qihao Chen , Yuefeng Ying , Mingzhu Hu , Bolun Dong , Sanbao Lin , Yangyang Fan , Xiaoyu Cai , Tong Jin
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引用次数: 0
Abstract
Periodic ultrasonic vibration enhances aluminum alloy weld surface properties by constructing a laminate microstructure, significantly improving wear and corrosion resistance. This study examined how periodic ultrasonic vibration influence laminate microstructure development, wear resistance, and corrosion resistance. The main results are as follows: The laminate weld microstructures with different layer widths could be designed by varying the switching-on/off time of the ultrasonic vibrations. The stratification features become less distinct when the switching-on/off time is short, as this leads to a reduced distance between layers. Weld microstructures with obvious delamination characteristics can be obtained when the switching-on/off time is 0.4 s and 0.7 s. Following the application of periodic ultrasonic vibration, a significant increase in both dislocation density within the weld grains and the number of subgrain boundaries was observed. The interfacial density and subgrain structure play a crucial role in determining the wear and corrosion resistance properties of weld. The application of ultrasonic vibration with a switching-on/off time of 0.1 s/0.1 s leads to significant improvements in weld performance, showing a 49.67 % reduction in wear rate and a 52.92 % decrease in corrosion current density compared to the original weld characteristics.
期刊介绍:
The aim of the journal is to provide a respectful outlet for ''sound science'' papers in all research areas on surfaces and interfaces. We define sound science papers as papers that describe new and well-executed research, but that do not necessarily provide brand new insights or are merely a description of research results.
Surfaces and Interfaces publishes research papers in all fields of surface science which may not always find the right home on first submission to our Elsevier sister journals (Applied Surface, Surface and Coatings Technology, Thin Solid Films)