Mechanisms of ductile-to-brittle transition in Sn−3.0Ag−0.5Cu solder alloy at cryogenic temperature

IF 4.7 1区材料科学 Q1 METALLURGY & METALLURGICAL ENGINEERING

Transactions of Nonferrous Metals Society of China Pub Date : 2025-04-01 DOI:10.1016/S1003-6326(24)66748-8

Sheng-li LI , Chun-jin HANG , Qi-long GUAN , Xiao-jiu TANG , Ning ZHOU , Yan-hong TIAN , Wei ZHANG , Dan YU , Ying DING , Xiu-li WANG

{"title":"Mechanisms of ductile-to-brittle transition in Sn−3.0Ag−0.5Cu solder alloy at cryogenic temperature","authors":"Sheng-li LI , Chun-jin HANG , Qi-long GUAN , Xiao-jiu TANG , Ning ZHOU , Yan-hong TIAN , Wei ZHANG , Dan YU , Ying DING , Xiu-li WANG","doi":"10.1016/S1003-6326(24)66748-8","DOIUrl":null,"url":null,"abstract":"<div><div>The inherent brittle behavior and ductile-to-brittle transition (DBT) mechanism of Sn−3.0Ag−0.5Cu (SAC305) solder alloy at the liquid nitrogen temperature (LNT, 77 K) were investigated through uniaxial tensile experiments conducted at different temperatures. Dynamic recovery and recrystallization of SAC305 solder alloy at room temperature (RT, 293 K) activate a softening process. Conversely, intersecting and none-intersecting deformation twins, embedded in body-centered tetragonal Sn, enhance tensile strength and stabilize strain hardening rate, while suppressing the elongation of the alloy at LNT. The irreconcilable velocity difference between twin thickening (~8 µm/s) and dislocation slip (~4 µm/s) results in premature brittle fracture, during the linear hardening and DBT. Moreover, the secondary phases degrade the mechanical property of SAC305 solder alloy, and micro-cracks appear between Cu<sub>6</sub>Sn<sub>5</sub> and Ag<sub>3</sub>Sn in the eutectic matrix.</div></div>","PeriodicalId":23191,"journal":{"name":"Transactions of Nonferrous Metals Society of China","volume":"35 4","pages":"Pages 1281-1291"},"PeriodicalIF":4.7000,"publicationDate":"2025-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transactions of Nonferrous Metals Society of China","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1003632624667488","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"METALLURGY & METALLURGICAL ENGINEERING","Score":null,"Total":0}

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Abstract

The inherent brittle behavior and ductile-to-brittle transition (DBT) mechanism of Sn−3.0Ag−0.5Cu (SAC305) solder alloy at the liquid nitrogen temperature (LNT, 77 K) were investigated through uniaxial tensile experiments conducted at different temperatures. Dynamic recovery and recrystallization of SAC305 solder alloy at room temperature (RT, 293 K) activate a softening process. Conversely, intersecting and none-intersecting deformation twins, embedded in body-centered tetragonal Sn, enhance tensile strength and stabilize strain hardening rate, while suppressing the elongation of the alloy at LNT. The irreconcilable velocity difference between twin thickening (~8 µm/s) and dislocation slip (~4 µm/s) results in premature brittle fracture, during the linear hardening and DBT. Moreover, the secondary phases degrade the mechanical property of SAC305 solder alloy, and micro-cracks appear between Cu₆Sn₅ and Ag₃Sn in the eutectic matrix.

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低温下Sn−3.0Ag−0.5Cu钎料合金韧脆转变机理

通过不同温度下的单轴拉伸实验，研究了Sn−3.0Ag−0.5Cu （SAC305）钎料合金在液氮温度（LNT, 77 K）下的固有脆性行为和韧脆转变（DBT）机制。SAC305钎料合金在室温（RT, 293 K）下的动态恢复和再结晶激活了一个软化过程。相反，在体心四方Sn中嵌入相贯变形孪晶和相贯变形孪晶提高了合金的抗拉强度，稳定了应变硬化速率，同时抑制了合金在LNT处的伸长率。在线性硬化和DBT过程中，孪晶增厚（~8µm/s）和位错滑移（~4µm/s）之间的速度差不可调和，导致过早脆性断裂。此外，SAC305钎料合金的二次相降低了其力学性能，共晶基体中Cu6Sn5与Ag3Sn之间出现了微裂纹。

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来源期刊

Transactions of Nonferrous Metals Society of China 工程技术-冶金工程

CiteScore

7.40

自引率

17.80%

发文量

8456

审稿时长

3.6 months

期刊介绍： The Transactions of Nonferrous Metals Society of China (Trans. Nonferrous Met. Soc. China), founded in 1991 and sponsored by The Nonferrous Metals Society of China, is published monthly now and mainly contains reports of original research which reflect the new progresses in the field of nonferrous metals science and technology, including mineral processing, extraction metallurgy, metallic materials and heat treatments, metal working, physical metallurgy, powder metallurgy, with the emphasis on fundamental science. It is the unique preeminent publication in English for scientists, engineers, under/post-graduates on the field of nonferrous metals industry. This journal is covered by many famous abstract/index systems and databases such as SCI Expanded, Ei Compendex Plus, INSPEC, CA, METADEX, AJ and JICST.