Enhancing the Performance of Epoxy-Based Solder Resist via Imide Ring Incorporation and Acid Value Regulation

IF 4.4 2区化学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

ACS Applied Polymer Materials Pub Date : 2025-04-05 DOI:10.1021/acsapm.5c0028210.1021/acsapm.5c00282

Jialin Zhang, Hangqian Wang, Tao Wang, Xialei Lv, Jinhui Li*, Shuye Zhang*, Guoping Zhang* and Rong Sun,

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Abstract

Solder resist (SR), a critical material for printed circuit boards, plays an essential role in advanced packaging technologies. In this study, the imide ring was incorporated into the molecular structure of the SR matrix resin, and the comprehensive performance of SR was significantly improved by utilizing the superior chemical properties of the imide ring. Additionally, by adjusting the acid value of the resin, we effectively controlled both the hydrogen bond index of the resin and the cross-linking density of SR, allowing for further optimization of SR properties. A systematic analysis of SR properties revealed that SR-3 exhibited a peel strength of up to 0.43 N/mm, tensile strength of 81.77 MPa, elongation at break of 6.3%, and a coefficient of thermal expansion 1 (CTE1) as low as 23.25 ppm/K, along with excellent acid and alkali resistance, hydrophobicity, thermal stability. These experimental results provide a deep insight into the logical relationship between the structure of the base resin and the comprehensive performance of SR, which is important for understanding the impact of base resin structure on SR performance and offers a strategy for developing high-performance SR. Furthermore, comparative analysis with the commercial product POR demonstrated that SR-3 exhibits significant application potential in advanced packaging.

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通过加入亚胺环和调节酸值来提高环氧基阻焊剂的性能

阻焊剂（SR）是印刷电路板的关键材料，在先进的封装技术中起着至关重要的作用。本研究将亚胺环引入SR基树脂的分子结构中，利用亚胺环优越的化学性质，显著提高了SR的综合性能。此外，通过调节树脂的酸值，我们可以有效地控制树脂的氢键指数和SR的交联密度，从而进一步优化SR的性能。SR-3的剥离强度高达0.43 N/mm，抗拉强度为81.77 MPa，断裂伸长率为6.3%，热膨胀系数1 （CTE1）低至23.25 ppm/K，具有优异的耐酸碱、疏水性和热稳定性。这些实验结果深入揭示了基础树脂结构与SR综合性能之间的逻辑关系，这对于理解基础树脂结构对SR性能的影响以及开发高性能SR提供了重要的策略。此外，与商业产品POR的比较分析表明SR-3在先进封装中具有显着的应用潜力。

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来源期刊

ACS Applied Polymer Materials Multiple-

CiteScore

7.20

自引率

6.00%

发文量

810

期刊介绍： ACS Applied Polymer Materials is an interdisciplinary journal publishing original research covering all aspects of engineering, chemistry, physics, and biology relevant to applications of polymers. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrates fundamental knowledge in the areas of materials, engineering, physics, bioscience, polymer science and chemistry into important polymer applications. The journal is specifically interested in work that addresses relationships among structure, processing, morphology, chemistry, properties, and function as well as work that provide insights into mechanisms critical to the performance of the polymer for applications.