Synergy between Copper and Silver Nanoparticles for the Removal of Thiophenic Compounds in Fuel Oil

IF 1.8 4区 工程技术 Q3 ENGINEERING, CHEMICAL
Shuo Ai, Yihan Yang, Kaili Gao, Wanguo Yu
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引用次数: 0

Abstract

Thiophenic compounds in fuel oils lead to the emission of SOx pollutants. Zero-valence Cu and Ag particles were supported on carbonized cellulose via reduction reactions. Only Cu(0) and Ag(0) microcrystals with sizes of 4–15 nm and 10–30 nm had high thiophene adsorption capacity. The growth of Cu crystals was inhibited by Ag+, whereas the dispersion and loading of Ag were promoted by Cu2+. The removal rates for thiophenic compounds in high-sulfur content oil reached 35.3–54.3 %. The steric hindrance of substituent groups had a negative impact on the desulfurization effect. The thiophene adsorption capacity reached 8.7 mg sulfur/g. This thiophene adsorption process agreed with Elovich and second-order kinetics as well as Langmuir and Freundlich models, implying that a monolayer of thiophene was adsorbed on a heterogeneous surface via chemisorption. The coordination interactions between sulfur and metals dominated the adsorption process.

Abstract Image

铜和银纳米粒子协同去除燃料油中的噻吩类化合物
燃料油中的噻吩类化合物会导致硫氧化物污染物的排放。通过还原反应将零价Cu和Ag颗粒负载在碳化纤维素上。只有尺寸为4 ~ 15 nm和10 ~ 30 nm的Cu(0)和Ag(0)微晶具有较高的噻吩吸附能力。Ag+抑制了Cu晶体的生长,而Cu2+则促进了Ag的分散和负载。高含硫量油中噻吩类化合物的去除率达35.3% ~ 54.3%。取代基的位阻对脱硫效果有负面影响。噻吩的吸附量达到8.7 mg硫/g。该吸附过程符合Elovich和二阶动力学以及Langmuir和Freundlich模型,表明单层噻吩通过化学吸附被吸附在非均相表面上。硫与金属的配位相互作用主导了吸附过程。
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来源期刊
Chemical Engineering & Technology
Chemical Engineering & Technology 工程技术-工程:化工
CiteScore
3.80
自引率
4.80%
发文量
315
审稿时长
5.5 months
期刊介绍: This is the journal for chemical engineers looking for first-hand information in all areas of chemical and process engineering. Chemical Engineering & Technology is: Competent with contributions written and refereed by outstanding professionals from around the world. Essential because it is an international forum for the exchange of ideas and experiences. Topical because its articles treat the very latest developments in the field.
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