Ajay Kumar, Prashant Kumar, Radhapiyari Laishram, Shivnath Kumar, J. S. Rawat, Amit Jain
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引用次数: 0
Abstract
A large-area centimeter-scale (2 cm × 1 cm) high-quality continuous MoS2 film was grown on a SiO2/Si substrate via the Chemical Vapor Deposition (CVD) technique to ensure the scalability and uniformity of the MoS2 film across a large area, rendering it suitable for wafer-scale applications. We further establish the transfer of MoS2 film from the grown substrate (SiO2/Si) to Interdigitated Electrodes (IDE) structures fabricated on GaAs substrate via a wet etching process utilizing Hydrogen Fluoride (HF) solution, effectively removing the MoS2 layer from SiO2/Si substrate within 2–3 min, while preserving the structural integrity and quality of the MoS2 film. Characterization studies involving Raman analysis, Photoluminescence (PL) mapping, SEM imaging, and optoelectronics measurements confirm the high quality and integrity of the transferred MoS2 film onto IDE structures fabricated on GaAs substrate for photodetection application. Optoelectronic measurements revealed a significant responsivity enhancement from 2.13 to 26.4 mA/W at a 20 V bias under 780 nm laser illuminations (5 mW), due to the incorporation of gold nanoparticles between the IDE fingers by employing RF sputtering. Thus, integrating nanoparticles in the active region of optoelectronic devices can markedly enhance the optical efficiency of 2D material-based optoelectronic systems. Overall, this CVD technique presents a viable approach for the scalable production of large-area MoS2 films and their transfer onto fabricated structures, opening avenues for the integration of MoS2 films into advanced technological devices and systems, particularly in micro and Nano-electromechanical systems.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.