Scalable growth and transfer of large-area MoS2 film on IDE structures for photo-detector application

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Ajay Kumar, Prashant Kumar, Radhapiyari Laishram, Shivnath Kumar, J. S. Rawat, Amit Jain
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Abstract

A large-area centimeter-scale (2 cm × 1 cm) high-quality continuous MoS2 film was grown on a SiO2/Si substrate via the Chemical Vapor Deposition (CVD) technique to ensure the scalability and uniformity of the MoS2 film across a large area, rendering it suitable for wafer-scale applications. We further establish the transfer of MoS2 film from the grown substrate (SiO2/Si) to Interdigitated Electrodes (IDE) structures fabricated on GaAs substrate via a wet etching process utilizing Hydrogen Fluoride (HF) solution, effectively removing the MoS2 layer from SiO2/Si substrate within 2–3 min, while preserving the structural integrity and quality of the MoS2 film. Characterization studies involving Raman analysis, Photoluminescence (PL) mapping, SEM imaging, and optoelectronics measurements confirm the high quality and integrity of the transferred MoS2 film onto IDE structures fabricated on GaAs substrate for photodetection application. Optoelectronic measurements revealed a significant responsivity enhancement from 2.13 to 26.4 mA/W at a 20 V bias under 780 nm laser illuminations (5 mW), due to the incorporation of gold nanoparticles between the IDE fingers by employing RF sputtering. Thus, integrating nanoparticles in the active region of optoelectronic devices can markedly enhance the optical efficiency of 2D material-based optoelectronic systems. Overall, this CVD technique presents a viable approach for the scalable production of large-area MoS2 films and their transfer onto fabricated structures, opening avenues for the integration of MoS2 films into advanced technological devices and systems, particularly in micro and Nano-electromechanical systems.

用于光电探测器的IDE结构上大面积MoS2薄膜的可伸缩生长和转移
通过化学气相沉积(CVD)技术在SiO2/Si衬底上生长出大面积厘米级(2 cm × 1 cm)的高质量连续MoS2薄膜,确保了MoS2薄膜在大面积上的可扩展性和均匀性,使其适合晶圆级应用。我们进一步建立了MoS2薄膜从生长的衬底(SiO2/Si)转移到GaAs衬底上的交叉电极(IDE)结构,通过使用氟化氢(HF)溶液的湿蚀刻工艺,在2-3分钟内有效地从SiO2/Si衬底上去除MoS2层,同时保持MoS2薄膜的结构完整性和质量。表征研究包括拉曼分析,光致发光(PL)测绘,SEM成像和光电子测量证实了转移到GaAs衬底上的IDE结构上的MoS2薄膜的高质量和完整性,用于光探测应用。光电测量结果显示,在20v偏压下,在780 nm激光照射(5 mW)下,由于采用射频溅射将金纳米颗粒掺入IDE手指之间,IDE手指的响应率从2.13 mA/W显著提高到26.4 mA/W。因此,在光电器件的有源区集成纳米粒子可以显著提高二维材料光电系统的光学效率。总的来说,这种CVD技术为大面积MoS2薄膜的可扩展生产及其转移到制造结构上提供了一种可行的方法,为将MoS2薄膜集成到先进的技术设备和系统,特别是在微纳米机电系统中开辟了道路。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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