Benchmarking and Reproducibility in Computational and Experimental Characterization of Electronic Packages for Signal/Power Integrity: Four benchmarks serve as standardized cases

Abstract

This article describes current initiatives to form benchmarks for the characterization of electronic packages. Four available benchmarks representing typical cases for signal integrity (SI) and power integrity (PI) analysis and varying in complexity from simple microstrip line to a full package model are intended to serve as standardized cases for testing the performance and accuracy of the modeling tools. While the benchmarks, consisting of CAD model files as well as simulated and measured network parameters, are publicly available and described in the accompanying manual, the emphasis in this article is on the description of challenges encountered in creating measured data, the development of modeling capabilities in the computational tools essential for accurate and expedient electromagnetic (EM) analysis of the benchmarks, and common practices going into matching of the simulated to the measured data. Ongoing efforts toward the standardization of densely packed interconnects for die-to-die interfacing on advanced packages, also known as heterogeneous integration (HI), are discussed in the context of the Open Compute Project (OCP). Emerging needs for benchmarking and standardization of test cases and training datasets for machine learning (ML)-assisted characterization of high-speed channels are also outlined.