Yu Tan , Wei Rao , Ke Wan , Kun Peng , Jianjun Zhao , Xiangyu Li
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引用次数: 0
Abstract
Piezoelectrics are often subjected to cyclic loads during service, leading to the occurrence of fatigue fracture. Traditional models typically employ the ideal electric boundary conditions to describe the distribution of electric field on crack faces, which may fail to accurately reflect the influence of electric properties on the fatigue life of piezoelectrics. In this work, a phase-field model for fatigue crack growth in piezoelectrics is proposed. By constructing the suitable degradation function, the energetically consistent boundary condition (ECBC) is involved in the present model. The ECBC considers the effect of crack-filled mediums on electric properties, allowing for a more accurate description of electric characteristics on crack faces. Numerical simulations are performed to investigate the effects of the electric boundary condition and external electric field on fatigue behaviors of piezoelectrics. The medium within the crack may significantly affect the fatigue life of piezoelectrics. The higher the relative dielectric constant of the ECBC, the closer the predicted fatigue life is to the situation under electrically permeable boundary condition. The present study may provide a theoretical tool for assessing the lifetime of piezoelectrics.
期刊介绍:
The International Journal of Solids and Structures has as its objective the publication and dissemination of original research in Mechanics of Solids and Structures as a field of Applied Science and Engineering. It fosters thus the exchange of ideas among workers in different parts of the world and also among workers who emphasize different aspects of the foundations and applications of the field.
Standing as it does at the cross-roads of Materials Science, Life Sciences, Mathematics, Physics and Engineering Design, the Mechanics of Solids and Structures is experiencing considerable growth as a result of recent technological advances. The Journal, by providing an international medium of communication, is encouraging this growth and is encompassing all aspects of the field from the more classical problems of structural analysis to mechanics of solids continually interacting with other media and including fracture, flow, wave propagation, heat transfer, thermal effects in solids, optimum design methods, model analysis, structural topology and numerical techniques. Interest extends to both inorganic and organic solids and structures.