High-Definition Area-Specific Printing of Patterned Conductive Sub-μm Features for Large-Area Electronics Manufacturing

Abstract

Additive manufacturing has experienced rapid growth and has become widely used in materials development and process technologies. In particular, the rapid expansion of electronics manufacturing for low-cost electronics drives the need for cost-effective material deposition and processing techniques that can be integrated within existing fabrication processes. In this study, we achieved 500 nm patterns using a single-step, high-definition deposition technique, which includes photolithography/e-beam lithography, plasma-jet printing, and lift-off procedures. We also demonstrated the versatility of this method on both rigid and flexible substrates by fabricating patterns on silicon and Kapton. Finally, we showcased two key applications: the development of high-precision alignment markers for subsequent lithography processes and the deposition of multiple materials within a single-step process. The promising results demonstrate its potential as a viable alternative to traditional semiconductor manufacturing processes.