Research progress on negative temperature coefficient thermistors: review

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2025-04-20 DOI:10.1007/s10854-025-14727-w

Zhenlin Song, Zengji Chen, Gang Du, Linling Huang, Jia Yin, Jianfeng Cao, Yiping Guo

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引用次数: 0

Abstract

The global negative temperature coefficient (NTC) thermistor market produces over four billion units annually, with applications spanning industrial manufacturing, aerospace, and household appliances. With the increasing adoption of new energy vehicles and energy storage systems, the demand for reliable temperature control in battery systems has grown significantly. NTC thermistors, renowned for their precision, miniaturization, and rapid response, play a crucial role in maintaining optimal battery temperatures, which contributes to prolonged battery life and enhanced system reliability. Over the past two centuries, various materials have been used to develop NTC thermistors. However, early NTC thermistors often suffered from issues such as a narrow temperature measurement range and poor stability. Therefore, it is necessary to review the effects of different materials, dopants, and manufacturing processes on the electrical properties of NTC thermistors to promote further research and applications. This paper provides a comprehensive review of the characteristics, development history, performance index, and temperature-sensing mechanisms of NTC thermistors. Additionally, it summarizes the current research status and future directions for various types of NTC thermistors.

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负温度系数热敏电阻研究进展：综述

全球负温度系数（NTC）热敏电阻市场每年生产超过40亿个，应用领域涵盖工业制造、航空航天和家用电器。随着新能源汽车和储能系统的日益普及，电池系统对可靠温度控制的需求显著增长。NTC热敏电阻以其精密，小型化和快速响应而闻名，在保持最佳电池温度方面发挥着至关重要的作用，这有助于延长电池寿命并提高系统可靠性。在过去的两个世纪里，各种材料被用来开发NTC热敏电阻。然而，早期的NTC热敏电阻通常存在温度测量范围窄、稳定性差等问题。因此，有必要对不同材料、掺杂剂和制造工艺对NTC热敏电阻电性能的影响进行综述，以促进NTC热敏电阻的进一步研究和应用。本文综述了NTC热敏电阻的特点、发展历史、性能指标和温度传感机理。总结了各类NTC热敏电阻的研究现状和未来发展方向。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.