Influence of diamond particle size on thermal expansion and thermal stability of Al/diamond composite

IF 4.3 3区 材料科学 Q2 MATERIALS SCIENCE, COATINGS & FILMS
Yongjian Zhang , Ning Li , Jinpeng Hao , Yang Luo , Xitao Wang , Hailong Zhang
{"title":"Influence of diamond particle size on thermal expansion and thermal stability of Al/diamond composite","authors":"Yongjian Zhang ,&nbsp;Ning Li ,&nbsp;Jinpeng Hao ,&nbsp;Yang Luo ,&nbsp;Xitao Wang ,&nbsp;Hailong Zhang","doi":"10.1016/j.diamond.2025.112342","DOIUrl":null,"url":null,"abstract":"<div><div>Suitable coefficient of thermal expansion (CTE) is critical to electronic packaging application of Al/diamond composite as a heat dissipation substrate close to chips. Diamond particle size is an important parameter for the preparation of Al/diamond composite; however, the effect of diamond particle size on thermal expansion of the Al/diamond composite is still unclear. In this study, we report on the thermal expansion behavior of the Al/diamond composites with diamond particle size ranging from 66 to 701 μm. The results show that the in-situ formed interfacial Al<sub>4</sub>C<sub>3</sub> tightly bonds the Al matrix and diamond reinforcement, and the Al<sub>4</sub>C<sub>3</sub> amount is similar in the composites with various diamond particle sizes. The dislocation density induced in the Al matrix by heating/cooling cycles is decreased with increasing diamond particle size. The CTE values of the Al/diamond composites are measured to be 5.3–5.9 × 10<sup>−6</sup>/K and they are increased after thermal cycling, ascribed to the weakening of interfacial bonding strength. With increasing diamond particle size, the CTE of the Al/diamond composite increases, but the thermal stability of CTE is enhanced. The study offers useful guideline for regulating the CTE of Al/diamond composite for critical electronic packaging applications.</div></div>","PeriodicalId":11266,"journal":{"name":"Diamond and Related Materials","volume":"155 ","pages":"Article 112342"},"PeriodicalIF":4.3000,"publicationDate":"2025-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Diamond and Related Materials","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0925963525003991","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, COATINGS & FILMS","Score":null,"Total":0}
引用次数: 0

Abstract

Suitable coefficient of thermal expansion (CTE) is critical to electronic packaging application of Al/diamond composite as a heat dissipation substrate close to chips. Diamond particle size is an important parameter for the preparation of Al/diamond composite; however, the effect of diamond particle size on thermal expansion of the Al/diamond composite is still unclear. In this study, we report on the thermal expansion behavior of the Al/diamond composites with diamond particle size ranging from 66 to 701 μm. The results show that the in-situ formed interfacial Al4C3 tightly bonds the Al matrix and diamond reinforcement, and the Al4C3 amount is similar in the composites with various diamond particle sizes. The dislocation density induced in the Al matrix by heating/cooling cycles is decreased with increasing diamond particle size. The CTE values of the Al/diamond composites are measured to be 5.3–5.9 × 10−6/K and they are increased after thermal cycling, ascribed to the weakening of interfacial bonding strength. With increasing diamond particle size, the CTE of the Al/diamond composite increases, but the thermal stability of CTE is enhanced. The study offers useful guideline for regulating the CTE of Al/diamond composite for critical electronic packaging applications.

Abstract Image

金刚石粒度对Al/金刚石复合材料热膨胀和热稳定性的影响
合适的热膨胀系数(CTE)对于铝/金刚石复合材料作为靠近芯片的散热基板的电子封装应用至关重要。金刚石粒度是制备铝/金刚石复合材料的一个重要参数;然而,金刚石粒度对铝/金刚石复合材料热膨胀的影响仍不清楚。在本研究中,我们报告了金刚石粒度在 66 到 701 μm 之间的铝/金刚石复合材料的热膨胀行为。结果表明,原位形成的界面 Al4C3 将铝基体和金刚石增强体紧密结合在一起,而且不同金刚石粒度的复合材料中 Al4C3 的含量相似。随着金刚石粒度的增加,加热/冷却循环在铝基体中引起的位错密度降低。经测量,铝/金刚石复合材料的 CTE 值为 5.3-5.9 × 10-6/K,并且在热循环后会增加,这归因于界面结合强度的减弱。随着金刚石粒度的增大,铝/金刚石复合材料的 CTE 会增大,但 CTE 的热稳定性会增强。该研究为关键电子封装应用中调节铝/金刚石复合材料的 CTE 提供了有用的指导。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Diamond and Related Materials
Diamond and Related Materials 工程技术-材料科学:综合
CiteScore
6.00
自引率
14.60%
发文量
702
审稿时长
2.1 months
期刊介绍: DRM is a leading international journal that publishes new fundamental and applied research on all forms of diamond, the integration of diamond with other advanced materials and development of technologies exploiting diamond. The synthesis, characterization and processing of single crystal diamond, polycrystalline films, nanodiamond powders and heterostructures with other advanced materials are encouraged topics for technical and review articles. In addition to diamond, the journal publishes manuscripts on the synthesis, characterization and application of other related materials including diamond-like carbons, carbon nanotubes, graphene, and boron and carbon nitrides. Articles are sought on the chemical functionalization of diamond and related materials as well as their use in electrochemistry, energy storage and conversion, chemical and biological sensing, imaging, thermal management, photonic and quantum applications, electron emission and electronic devices. The International Conference on Diamond and Carbon Materials has evolved into the largest and most well attended forum in the field of diamond, providing a forum to showcase the latest results in the science and technology of diamond and other carbon materials such as carbon nanotubes, graphene, and diamond-like carbon. Run annually in association with Diamond and Related Materials the conference provides junior and established researchers the opportunity to exchange the latest results ranging from fundamental physical and chemical concepts to applied research focusing on the next generation carbon-based devices.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信