{"title":"Correlation Analysis Between Porosity and Mechanical Properties of Porous Sintered Nanosilver Based on Indentation Response","authors":"Xu Long, Xiaoyue Ding, Tianjiao Mou, Fuchun Zhang, Ruipeng Dong, Jiaqi Zhu, Ziyi Shen, Percy M. Iyela, Wuzhu Yan, Jun Liu, Xiaoliang Geng, Chao Chang","doi":"10.1007/s11665-025-10895-2","DOIUrl":null,"url":null,"abstract":"<div><p>Sintered nanosilver has become a popular research topic in the electronics packaging industry due to its advantage of low-temperature sintering and high-temperature working capacity. However, the relationship between the microporous structure of sintered nanosilver materials and their macroscopic mechanical properties has not been fully explored. In this study, load–displacement curves of porous sintered nanosilver materials were obtained through indentation experiments. Finite element simulation was then applied to sintered nanosilver materials with different porosities to understand the impact of porosity on their mechanical properties. Using a two-dimensional axisymmetric indentation model based on the finite element method, sintered nanosilver with a porosity of 10% was indented to a depth of 10 <span>\\(\\upmu\\)</span>m. The sintered nanosilver matrix model had dimensions of 0.25 mm × 0.25 mm. Simulations were carried out on sintered nanosilver with porosities of 10, 20, 25, and 30%. Indentation curves and stress–strain curves were obtained for each porosity. The mechanical properties of the materials, such as Young’s modulus and yield strength, were analyzed using indentation curves. The results show that the Young’s modulus and yield strength gradually decrease with increasing porosity of the sintered nanosilver material. This study has successfully explained the correlation between the elastoplastic mechanical properties and the indentation response of sintered nanosilver materials with different porosities. In addition, this paper discusses the relationship between the mechanical properties and porous structure of sintered nanosilver materials in detail, providing a more comprehensive experimental basis and theoretical support for research and practical application in high-power electronic devices.</p></div>","PeriodicalId":644,"journal":{"name":"Journal of Materials Engineering and Performance","volume":"34 6","pages":"4564 - 4572"},"PeriodicalIF":2.2000,"publicationDate":"2025-02-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Engineering and Performance","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s11665-025-10895-2","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Sintered nanosilver has become a popular research topic in the electronics packaging industry due to its advantage of low-temperature sintering and high-temperature working capacity. However, the relationship between the microporous structure of sintered nanosilver materials and their macroscopic mechanical properties has not been fully explored. In this study, load–displacement curves of porous sintered nanosilver materials were obtained through indentation experiments. Finite element simulation was then applied to sintered nanosilver materials with different porosities to understand the impact of porosity on their mechanical properties. Using a two-dimensional axisymmetric indentation model based on the finite element method, sintered nanosilver with a porosity of 10% was indented to a depth of 10 \(\upmu\)m. The sintered nanosilver matrix model had dimensions of 0.25 mm × 0.25 mm. Simulations were carried out on sintered nanosilver with porosities of 10, 20, 25, and 30%. Indentation curves and stress–strain curves were obtained for each porosity. The mechanical properties of the materials, such as Young’s modulus and yield strength, were analyzed using indentation curves. The results show that the Young’s modulus and yield strength gradually decrease with increasing porosity of the sintered nanosilver material. This study has successfully explained the correlation between the elastoplastic mechanical properties and the indentation response of sintered nanosilver materials with different porosities. In addition, this paper discusses the relationship between the mechanical properties and porous structure of sintered nanosilver materials in detail, providing a more comprehensive experimental basis and theoretical support for research and practical application in high-power electronic devices.
烧结纳米银由于具有低温烧结和高温工作能力等优点,已成为电子封装行业的热门研究课题。然而,烧结纳米银材料的微孔结构与其宏观力学性能之间的关系尚未得到充分的探讨。本研究通过压痕实验获得了多孔烧结纳米银材料的载荷-位移曲线。然后对不同孔隙率的烧结纳米银材料进行有限元模拟,了解孔隙率对其力学性能的影响。采用基于有限元法的二维轴对称压痕模型,烧结了孔隙率为10的纳米银% was indented to a depth of 10 \(\upmu\)m. The sintered nanosilver matrix model had dimensions of 0.25 mm × 0.25 mm. Simulations were carried out on sintered nanosilver with porosities of 10, 20, 25, and 30%. Indentation curves and stress–strain curves were obtained for each porosity. The mechanical properties of the materials, such as Young’s modulus and yield strength, were analyzed using indentation curves. The results show that the Young’s modulus and yield strength gradually decrease with increasing porosity of the sintered nanosilver material. This study has successfully explained the correlation between the elastoplastic mechanical properties and the indentation response of sintered nanosilver materials with different porosities. In addition, this paper discusses the relationship between the mechanical properties and porous structure of sintered nanosilver materials in detail, providing a more comprehensive experimental basis and theoretical support for research and practical application in high-power electronic devices.
期刊介绍:
ASM International''s Journal of Materials Engineering and Performance focuses on solving day-to-day engineering challenges, particularly those involving components for larger systems. The journal presents a clear understanding of relationships between materials selection, processing, applications and performance.
The Journal of Materials Engineering covers all aspects of materials selection, design, processing, characterization and evaluation, including how to improve materials properties through processes and process control of casting, forming, heat treating, surface modification and coating, and fabrication.
Testing and characterization (including mechanical and physical tests, NDE, metallography, failure analysis, corrosion resistance, chemical analysis, surface characterization, and microanalysis of surfaces, features and fractures), and industrial performance measurement are also covered