3-D Printing of PAM Hydrogel-Based Iontronic for Dual-Mode Epidermal Sensors

IF 4.3 2区综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Sensors Journal Pub Date : 2025-03-13 DOI:10.1109/JSEN.2025.3549188

Yue Zhang;Ao Lan;Yuanhao Xia;Xiangyu Yin;Bingwei He;Pengli Zhu

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引用次数: 0

Abstract

The advancement of hydrogel-based epidermal sensors that integrate multifunctionality, high transparency, rapid processing, and heightened sensitivity is of significant interest. Herein, we present an efficient approach for the fabrication of flexible dual-mode epidermal sensors through the ultraviolet (UV)-curing 3-D printing of polyacrylamide (PAM)-based ionic hydrogels. The hydrogel precursor incorporates sodium dodecyl sulfate (SDS) monomers to augment the water dispersibility of the 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO) photoinitiator, thereby substantially increasing the photocuring efficiency of the ionic hydrogel. As a result, the distinctive surface microstructures of PAM-based ionic hydrogels can be engineered for sensors with varying sensing modalities to improve detection performance. The piezoelectric tactile sensor, incorporating a concentric ring microstructure, demonstrates a sensitivity coefficient of

$1.39~\text {mV}\cdot \text { kPa}^{-{1}}$

. Conversely, the resistive strain sensor, characterized by a high-density reticular hollow structure, exhibits the highest gauge factor of 24.87. Furthermore, each sensor modality demonstrates excellent temporal response and stability, confirming its applicability in motion monitoring and Morse code transmission.

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来源期刊

IEEE Sensors Journal 工程技术-工程：电子与电气

CiteScore

7.70

自引率

14.00%

发文量

2058

审稿时长

5.2 months

期刊介绍： The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice