{"title":"Crystalline Si coating on diamond particles by silane CVD and the improving thermal conductivity of diamond-Si/Al composites","authors":"Jikun Deng, Jian Li, Zhenyu Li, Zechuan Wang, Guoqing Tong, Junwu Liu, Honghai Zhong, Yang Jiang","doi":"10.1016/j.diamond.2025.112333","DOIUrl":null,"url":null,"abstract":"<div><div>The chemical inertness of the diamond surface causes poor interfacial bonding between the diamond and matrix, which affects the thermal conductivity of composites, and further limits the industrial application of diamond composites. In this work, a uniform and dense Si film was deposited on large-grained diamond (150 μm) by silane chemical vapor deposition (CVD) to improve the wettability between diamond and aluminum (Al) metal matrix and thus enhance the thermal conductivity of diamond/Al composites. The analysis results showed that the surface of diamond particles was uniformly covered with a layer of Si coating after being treated by silane CVD at 700 °C for 30 min. Meanwhile, the oxidation temperature of the Si-coated diamond particles was increased by 70 °C, and the oxidative weight loss was reduced to 85 %, which possessed superior oxidation resistance and thermal stability than the pristine diamond particles. The thermal conductivity of the diamond-Si/Al composites with a diamond volume fraction of 45 % prepared by spark plasma sintering (SPS) technique reaches up to 467 W/m·K, the relative density is 99.1 %, and the coefficient of thermal expansion is also improved to 9.94 × 10<sup>−6</sup> K<sup>−1</sup>. The thermal stability of Si-coated diamond particles and their easy bonding with aluminum are conducive to expanding the application of the Si-coated diamonds in lightweight and high thermal conductivity composite packaging materials.</div></div>","PeriodicalId":11266,"journal":{"name":"Diamond and Related Materials","volume":"155 ","pages":"Article 112333"},"PeriodicalIF":4.3000,"publicationDate":"2025-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Diamond and Related Materials","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0925963525003905","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, COATINGS & FILMS","Score":null,"Total":0}
引用次数: 0
Abstract
The chemical inertness of the diamond surface causes poor interfacial bonding between the diamond and matrix, which affects the thermal conductivity of composites, and further limits the industrial application of diamond composites. In this work, a uniform and dense Si film was deposited on large-grained diamond (150 μm) by silane chemical vapor deposition (CVD) to improve the wettability between diamond and aluminum (Al) metal matrix and thus enhance the thermal conductivity of diamond/Al composites. The analysis results showed that the surface of diamond particles was uniformly covered with a layer of Si coating after being treated by silane CVD at 700 °C for 30 min. Meanwhile, the oxidation temperature of the Si-coated diamond particles was increased by 70 °C, and the oxidative weight loss was reduced to 85 %, which possessed superior oxidation resistance and thermal stability than the pristine diamond particles. The thermal conductivity of the diamond-Si/Al composites with a diamond volume fraction of 45 % prepared by spark plasma sintering (SPS) technique reaches up to 467 W/m·K, the relative density is 99.1 %, and the coefficient of thermal expansion is also improved to 9.94 × 10−6 K−1. The thermal stability of Si-coated diamond particles and their easy bonding with aluminum are conducive to expanding the application of the Si-coated diamonds in lightweight and high thermal conductivity composite packaging materials.
期刊介绍:
DRM is a leading international journal that publishes new fundamental and applied research on all forms of diamond, the integration of diamond with other advanced materials and development of technologies exploiting diamond. The synthesis, characterization and processing of single crystal diamond, polycrystalline films, nanodiamond powders and heterostructures with other advanced materials are encouraged topics for technical and review articles. In addition to diamond, the journal publishes manuscripts on the synthesis, characterization and application of other related materials including diamond-like carbons, carbon nanotubes, graphene, and boron and carbon nitrides. Articles are sought on the chemical functionalization of diamond and related materials as well as their use in electrochemistry, energy storage and conversion, chemical and biological sensing, imaging, thermal management, photonic and quantum applications, electron emission and electronic devices.
The International Conference on Diamond and Carbon Materials has evolved into the largest and most well attended forum in the field of diamond, providing a forum to showcase the latest results in the science and technology of diamond and other carbon materials such as carbon nanotubes, graphene, and diamond-like carbon. Run annually in association with Diamond and Related Materials the conference provides junior and established researchers the opportunity to exchange the latest results ranging from fundamental physical and chemical concepts to applied research focusing on the next generation carbon-based devices.