U-shaped configuration design of host materials for solution-processed organic light-emitting diodes

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2025-04-16 DOI:10.1007/s10854-025-14748-5

Qiyin Ran, Xinjian Wang, Guimin Zhao, Yuheng Lou, Renjie Ji, Shuai Lv, Wenwen Tian, Wei Jiang, Yueming Sun

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引用次数: 0

Abstract

The development of efficient host materials is crucial for improving the performance of thermally activated delayed fluorescence organic light-emitting diode. In this study, two U-shaped molecules (15CzCN, 24CzCN) and one rod-shaped molecule (14CzCN) were successfully designed and synthesized by tuning the connection sites of donor units. All three materials exhibited excellent thermal stability (T_d > 400 °C) and high triplet energy (E_T > 2.80 eV), demonstrating potential as host materials for green light emission. Furthermore, their photophysical properties were systematically investigated, with photoluminescence quantum yields (PLQYs) of 61.1 and 76.4% observed for 15CzCN and 24CzCN doped with 10% 4CzIPN, respectively, exceeding the 58.1% of 14CzCN. In device performance tests, the solution-processed device with 10% 4CzIPN as the dopant and 24CzCN as the host achieved a maximum external quantum efficiency (EQE_max) of 10.09%. This work offers new insights into the design and development of host materials for future applications.

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溶液处理有机发光二极管主材料的u型结构设计

高效主体材料的开发是提高热激活延迟荧光有机发光二极管性能的关键。本研究通过调整供体单元的连接位点，成功设计合成了两个u型分子（15CzCN、24CzCN）和一个棒状分子（14CzCN）。这三种材料均表现出优异的热稳定性（Td > 400°C）和高三重态能量（ET > 2.80 eV），显示出作为绿光发射主体材料的潜力。此外，系统地研究了它们的光物理性质，掺入10% 4czpn的15CzCN和24CzCN的光致发光量子产率（PLQYs）分别为61.1和76.4%，超过了14CzCN的58.1%。在器件性能测试中，以10% 4CzIPN为掺杂剂、24CzCN为主体的溶液处理器件获得了10.09%的最大外量子效率（EQEmax）。这项工作为未来应用的宿主材料的设计和开发提供了新的见解。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.