Chengfeng Ding , Yikai Jin , Yanyan Lin , Ningbo Cheng , Na Meng , Xianfeng Wang , Xia Yin , Jianyong Yu , Bin Ding
{"title":"Thermal diode-like metafabric with tunable asymmetric structure for continuous personal cooling","authors":"Chengfeng Ding , Yikai Jin , Yanyan Lin , Ningbo Cheng , Na Meng , Xianfeng Wang , Xia Yin , Jianyong Yu , Bin Ding","doi":"10.1016/j.mattod.2025.02.020","DOIUrl":null,"url":null,"abstract":"<div><div>Personal cooling textiles that can ensure human health and alleviate energy crises have been fabricated from various mechanisms including radiation, evaporation, and convection. However, there exists a significant challenge in achieving continuous cooling solely through thermal conduction especially in a changing environment. We report a novel strategy to create a thermal diode-like metafabric (TDM) with a tunable asymmetric structure that enables unidirectional thermal conductivity. The premise of the design is that the TDM dissipates body heat via the dense layer and insulates against environmental heat with the fluffy layer, making the heat dissipation function like a “thermal diode”. The resulting TDM can achieve a continuous cooling of 3.5 °C compared to cotton fabric, solely through thermal conduction. Additionally, it also integrates properties of ultrahigh air and moisture permeability, shape memory, and mechanical durability. The successful synthesis of such fascinating material may offer new perspectives on the design and advancement of thermal management materials in various fields.</div></div>","PeriodicalId":387,"journal":{"name":"Materials Today","volume":"85 ","pages":"Pages 91-99"},"PeriodicalIF":21.1000,"publicationDate":"2025-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Today","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369702125000707","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Personal cooling textiles that can ensure human health and alleviate energy crises have been fabricated from various mechanisms including radiation, evaporation, and convection. However, there exists a significant challenge in achieving continuous cooling solely through thermal conduction especially in a changing environment. We report a novel strategy to create a thermal diode-like metafabric (TDM) with a tunable asymmetric structure that enables unidirectional thermal conductivity. The premise of the design is that the TDM dissipates body heat via the dense layer and insulates against environmental heat with the fluffy layer, making the heat dissipation function like a “thermal diode”. The resulting TDM can achieve a continuous cooling of 3.5 °C compared to cotton fabric, solely through thermal conduction. Additionally, it also integrates properties of ultrahigh air and moisture permeability, shape memory, and mechanical durability. The successful synthesis of such fascinating material may offer new perspectives on the design and advancement of thermal management materials in various fields.
期刊介绍:
Materials Today is the leading journal in the Materials Today family, focusing on the latest and most impactful work in the materials science community. With a reputation for excellence in news and reviews, the journal has now expanded its coverage to include original research and aims to be at the forefront of the field.
We welcome comprehensive articles, short communications, and review articles from established leaders in the rapidly evolving fields of materials science and related disciplines. We strive to provide authors with rigorous peer review, fast publication, and maximum exposure for their work. While we only accept the most significant manuscripts, our speedy evaluation process ensures that there are no unnecessary publication delays.