Harnessing the power of copper-based metal–organic framework (HKUST-1) nanostructures for advanced wound healing

IF 5.2 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Advances Pub Date : 2025-03-07 DOI:10.1039/D4MA01220H

Dorsa Davoodian, Shirin Khaleghnia Rashkhar and Ali Es-haghi

{"title":"Harnessing the power of copper-based metal–organic framework (HKUST-1) nanostructures for advanced wound healing","authors":"Dorsa Davoodian, Shirin Khaleghnia Rashkhar and Ali Es-haghi","doi":"10.1039/D4MA01220H","DOIUrl":null,"url":null,"abstract":"<p >This review explores the potential of copper-based metal–organic frameworks (MOFs), particularly HKUST-1 (Hong Kong University of Science and Technology-1), as an innovative solution for advanced wound healing. Wound healing is a multifaceted process involving antimicrobial defense, inflammation control, and tissue regeneration, areas where copper ions play a vital role. HKUST-1, a porous, crystalline MOF with copper as its core component, offers unique structural properties that enhance its utility in biomedical applications. This review delves into the biocompatibility of HKUST-1, its ability to release copper ions in a controlled manner, and its antimicrobial and pro-regenerative effects on wound healing. We further analyze the potential benefits of incorporating HKUST-1 into wound care products, such as dressings, gels, and drug delivery systems, while also addressing challenges like stability under physiological conditions, potential toxicity, and scalability issues. Finally, this review discusses the prospects for translating HKUST-1-based nanostructures into clinical practice, aiming for improved patient outcomes and faster wound healing.</p>","PeriodicalId":18242,"journal":{"name":"Materials Advances","volume":" 8","pages":" 2477-2502"},"PeriodicalIF":5.2000,"publicationDate":"2025-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://pubs.rsc.org/en/content/articlepdf/2025/ma/d4ma01220h?page=search","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Advances","FirstCategoryId":"1085","ListUrlMain":"https://pubs.rsc.org/en/content/articlelanding/2025/ma/d4ma01220h","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

Abstract

This review explores the potential of copper-based metal–organic frameworks (MOFs), particularly HKUST-1 (Hong Kong University of Science and Technology-1), as an innovative solution for advanced wound healing. Wound healing is a multifaceted process involving antimicrobial defense, inflammation control, and tissue regeneration, areas where copper ions play a vital role. HKUST-1, a porous, crystalline MOF with copper as its core component, offers unique structural properties that enhance its utility in biomedical applications. This review delves into the biocompatibility of HKUST-1, its ability to release copper ions in a controlled manner, and its antimicrobial and pro-regenerative effects on wound healing. We further analyze the potential benefits of incorporating HKUST-1 into wound care products, such as dressings, gels, and drug delivery systems, while also addressing challenges like stability under physiological conditions, potential toxicity, and scalability issues. Finally, this review discusses the prospects for translating HKUST-1-based nanostructures into clinical practice, aiming for improved patient outcomes and faster wound healing.

查看原文本刊更多论文

利用铜基金属有机框架（HKUST-1）纳米结构的力量进行高级伤口愈合

本文探讨了铜基金属有机框架（mof）的潜力，特别是HKUST-1（香港科技大学1），作为先进伤口愈合的创新解决方案。伤口愈合是一个多方面的过程，涉及抗菌防御、炎症控制和组织再生，铜离子在这些领域起着至关重要的作用。HKUST-1是一种以铜为核心成分的多孔晶体MOF，具有独特的结构特性，可增强其在生物医学领域的应用。本文综述了HKUST-1的生物相容性、铜离子的可控释放能力、抗菌和促进伤口愈合的作用。我们进一步分析了将HKUST-1纳入伤口护理产品（如敷料，凝胶和药物输送系统）的潜在好处，同时也解决了生理条件下稳定性，潜在毒性和可扩展性问题等挑战。最后，本文讨论了将基于hkust -1的纳米结构转化为临床实践的前景，旨在改善患者的治疗效果和加快伤口愈合。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊