D. Mallikarjuna, A. Ashok Kumar, V. Janardhanam, V. Rajagopal Reddy
{"title":"Temperature-dependent current conduction properties and barrier inhomogeneity of Au/methylene blue (MB)/n-Ge heterostructure","authors":"D. Mallikarjuna, A. Ashok Kumar, V. Janardhanam, V. Rajagopal Reddy","doi":"10.1007/s10854-025-14717-y","DOIUrl":null,"url":null,"abstract":"<div><p>The electrical properties of Au/methylene blue (MB)/n-Ge heterostructure were investigated in a wide temperature range from 125 to 400 K. The device parameters such as barrier height, ideality factor and series resistance were determined using the thermionic emission (TE) model and Cheung’s method. The barrier height (<i>Φ</i><sub>b</sub>) and ideality factor (<i>n</i>) values of the Schottky contact were determined from the current–voltage (<i>I</i>–<i>V</i>) measurements and found to be 0.29 eV and 2.71 at 125 K and 0.93 eV and 1.04 at 400 K, respectively. In the presence of inhomogeneity at the metal–semiconductor contact, the barrier height was found to be decreased and the ideality factor increased with the decrease of temperature. From Cheung’s plot, the series resistance (<i>R</i><sub>s</sub>) was found to be reduced with the increase in temperature. Barrier inhomogeneity has been elucidated using the thermionic emission theory based on the assumption of Gaussian distribution of barrier heights. However, the divergence in Schottky barrier heights of Au/MB/n-Ge heterostructure evaluated from <i>I</i>–<i>V</i> measurements indicates deviation from the TE theory. The conventional Richardson plot between ln(<i>I</i><sub>o</sub>/<i>T</i><sup>2</sup>) vs. 1000/<i>T</i> gives an activation energy of 0.31 eV and Richardson constant (<i>A</i><sup>*</sup>) of 1.14 × 10<sup>–9</sup> Acm<sup>−2</sup> K<sup>−2</sup>. The modified Richardson plot evaluated by assuming the Gaussian distribution of <i>Φ</i><sub>b</sub> shows an enhanced activation energy of 1.15 eV and <i>A</i><sup>*</sup> of 209.28 Acm<sup>−2</sup> K<sup>−2</sup> which is close to the theoretical value of n-Ge. Current conduction mechanisms of the Au/MB/n-Ge contact in a wide temperature range are resolved into four linear regions (Region-I to Region-IV) with different slope factors. This shows that the interfacial layer (MB) significantly influences the electrical properties of the Au/n-Ge contacts measured in a wide temperature range. The interface state density distribution over the energy below the conduction band of the n-Ge is also studied in the temperature range from 125 to 400 K.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 11","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14717-y","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The electrical properties of Au/methylene blue (MB)/n-Ge heterostructure were investigated in a wide temperature range from 125 to 400 K. The device parameters such as barrier height, ideality factor and series resistance were determined using the thermionic emission (TE) model and Cheung’s method. The barrier height (Φb) and ideality factor (n) values of the Schottky contact were determined from the current–voltage (I–V) measurements and found to be 0.29 eV and 2.71 at 125 K and 0.93 eV and 1.04 at 400 K, respectively. In the presence of inhomogeneity at the metal–semiconductor contact, the barrier height was found to be decreased and the ideality factor increased with the decrease of temperature. From Cheung’s plot, the series resistance (Rs) was found to be reduced with the increase in temperature. Barrier inhomogeneity has been elucidated using the thermionic emission theory based on the assumption of Gaussian distribution of barrier heights. However, the divergence in Schottky barrier heights of Au/MB/n-Ge heterostructure evaluated from I–V measurements indicates deviation from the TE theory. The conventional Richardson plot between ln(Io/T2) vs. 1000/T gives an activation energy of 0.31 eV and Richardson constant (A*) of 1.14 × 10–9 Acm−2 K−2. The modified Richardson plot evaluated by assuming the Gaussian distribution of Φb shows an enhanced activation energy of 1.15 eV and A* of 209.28 Acm−2 K−2 which is close to the theoretical value of n-Ge. Current conduction mechanisms of the Au/MB/n-Ge contact in a wide temperature range are resolved into four linear regions (Region-I to Region-IV) with different slope factors. This shows that the interfacial layer (MB) significantly influences the electrical properties of the Au/n-Ge contacts measured in a wide temperature range. The interface state density distribution over the energy below the conduction band of the n-Ge is also studied in the temperature range from 125 to 400 K.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.